Service Guide

LTE Standard Module Series
EG91_Series_Hardware_Design
10
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4.1. General Description..............................................................................................................................58
4.2. GNSS Performance..............................................................................................................................58
4.3. Layout Guidelines.................................................................................................................................59
5 Antenna Interfaces...........................................................................................................................................60
5.1. Main/Rx-diversity Antenna Interfaces............................................................................................... 60
5.1.1. Pin Definition...............................................................................................................................60
5.1.2. Operating Frequency.................................................................................................................61
5.1.3. Reference Design of RF Antenna Interface...........................................................................62
5.2. GNSS Antenna Interface.....................................................................................................................63
5.3. Reference Design of RF Layout.........................................................................................................64
5.4. Antenna Installation..............................................................................................................................66
5.4.1. Antenna Requirement................................................................................................................66
5.4.2. Recommended RF Connector for Antenna Installation.......................................................67
6 Reliability
,
Radio and Electrical Characteristics
..................................................................................... 69
6.1. Absolute Maximum Ratings................................................................................................................ 69
6.2. Power Supply Ratings..........................................................................................................................69
6.3. Operating and Storage Temperatures.............................................................................................. 70
6.4. Current Consumption...........................................................................................................................70
6.5. RF Output Power.................................................................................................................................. 83
6.6. RF Receiving Sensitivity......................................................................................................................84
6.7. Electrostatic Discharge........................................................................................................................ 88
6.8. Thermal Consideration........................................................................................................................ 89
7 Mechanical Dimensions................................................................................................................................. 92
7.1. Mechanical Dimensions of the Module............................................................................................. 92
7.2. Recommended Footprint.....................................................................................................................95
7.3. Top and Bottom Views of the Module............................................................................................... 96
8 Storage, Manufacturing and Packaging.................................................................................................... 98
8.1. Storage................................................................................................................................................... 98
8.2. Manufacturing and Soldering..............................................................................................................99
8.3. Packaging............................................................................................................................................ 100
9 Appendix References....................................................................................................................................103