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EG91 Series

Hardware Design

LTE Standard Module Series

Version: 2.1

Date: 2021-11-05

Status: Released

Summary of content (108 pages)

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EG91 Series Hardware Design LTE Standard Module Series Version: 2.
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LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
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LTE Standard Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”).
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LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
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LTE Standard Module Series metal powders.
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LTE Standard Module Series About the Document Revision History Version Date Author Description 1.0 2017-03-22 Barret XIONG/ Rex WANG Initial Barret XIONG/ Rex WANG 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2. 3. Updated the functional diagram in Figure 1. 4. Updated module operating frequencies in Table 21. 5. Updated current consumption in Table 26. 6. Updated RF output power in Table 27. 7. Updated the conducted RF receiving sensitivity in Table 28. 8.
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LTE Standard Module Series 9. Updated module operating frequencies in Table 22. 10. Added description of GNSS antenna interface in Chapter 5.2. 11. Updated antenna requirements in Table 25. 12. Updated RF output power in Table 32. 1.3 1.4 1.5 2019-02-03 2019-03-29 2019-05-24 Barret XIONG/ Rex WANG 1. Added new variants EG91-NS, EG91-V, EG91-EC and related contents. 2. Opened pin 24 as ADC0 and added related contents. 3. Updated functional diagram (Figure 1) 4. Updated pin assignment (Figure 2) 5.
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LTE Standard Module Series 1.7 1.8 2019-08-09 2019-11-07 Barret XIONG/ Rex WANG 1. Added ThreadX variant EG91-NAX and updated related contents (Table 1 and 4, Chapter 2.2, 2.3, 3.2 and 5). 2. Added related notes of SPI interface not supported on ThreadX modules (Chapter 3.1, 3.3 and 3.13). 3. Added current consumption of EG91-NAX (Table 37). 4. Updated EG91-NA conducted RF receiving sensitivity (Table 41). 5. Updated EG91-NS conducted RF receiving sensitivity (Table 42). 6.
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LTE Standard Module Series 10. Updated module storage information (Chapter 8.1). 11. Updated the cooling down slope of reflow soldering thermal profile; Added a note to clarify the precautions if a conformal coating is necessary for the module (Chapter 8.2). 1. 2.0 2021-07-01 Barret XIONG/ Rex WANG 2. 1. 2021-07-28 2.1 2021-11-05 EG91_Series_Hardware_Design Barret XIONG/ Rex WANG Lark YU/ Frank WANG 2. 3. Added the related information of EG91-NAL in the whole document.
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LTE Standard Module Series Contents Safety Information...................................................................................................................................................... 3 About the Document..................................................................................................................................................5 Contents..................................................................................................................................
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LTE Standard Module Series 4.1. 4.2. 4.3. General Description..............................................................................................................................58 GNSS Performance..............................................................................................................................58 Layout Guidelines................................................................................................................................. 59 5 Antenna Interfaces....
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LTE Standard Module Series Table Index Table 1: Frequency Bands of EG91 Series Module............................................................................................ 18 Table 2: Key Features of EG91 Series Module.................................................................................................... 19 Table 3: Definition of I/O Parameters..................................................................................................................... 25 Table 4: Pin Description.
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LTE Standard Module Series Table 43: EG91-E Conducted RF Receiving Sensitivity..................................................................................... 85 Table 44: EG91-EX Conducted RF Receiving Sensitivity.................................................................................. 85 Table 45: EG91-NA Conducted RF Receiving Sensitivity.................................................................................. 86 Table 46: EG91-NAL Conducted RF Receiving Sensitivity................
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LTE Standard Module Series Figure Index Figure 1: Functional Diagram ................................................................................................................................ 22 Figure 2: Pin Assignment (Top View)..................................................................................................................... 24 Figure 3: Sleep Mode Application via UART.........................................................................................................
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LTE Standard Module Series Figure 42: EG91-E Bottom Dimensions (Top View)............................................................................................ 93 Figure 43: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX Bottom Dimensions (Top View)................ 94 Figure 44: Recommended Footprint (Top View).................................................................................................. 95 Figure 45: Top View of the Module..............................................................
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LTE Standard Module Series 1 Introduction This document defines the EG91 series module and describes its air interface and hardware interface which are connected with your applications. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG91 series module. With application note and user guide, you can use EG91 series module to design and set up mobile applications easily. FCC Certification Requirements.
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LTE Standard Module Series For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above).
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LTE Standard Module Series L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product.
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LTE Standard Module Series of EG91 series module.
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LTE Standard Module Series The following table describes the detailed features of EG91 series module. Table 2: Key Features of EG91 Series Module Feature Details Power Supply   Supply voltage: 3.3–4.3 V Typical supply voltage: 3.
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LTE Standard Module Series SMS     Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default (U)SIM Interfaces  Support 1.8 V and 3.
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LTE Standard Module Series   Rx-diversity antenna (ANT_DIV) GNSS antenna (ANT_GNSS) 5 Physical Characteristics    Size: (29.0 ±0.15) mm × (25.0 ±0.15) mm × (2.3 ±0.2) mm Package: LGA Weight: approx. 3.8 g Temperature Range    Operating temperature range: -35 °C to +75 °C Extended temperature range: -40 °C to +85 °C Storage temperature range: -40 °C to +90 °C Firmware Upgrade   USB interface DFOTA RoHS  All hardware components are fully compliant with EU RoHS directive 4 6 7 2.3.
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LTE Standard Module Series ANT_MAIN ANT_GNSS PAM SAW Duplexer ANT_DIV Switch LNA SAW VBAT_RF PA SAW PRx GPS Tx DRx NAND DDR2 SDRAM Transceiver IQ VBAT_BB PMIC PWRKEY Control Control Baseband RESET_N STATUS NETLIGHT 19.2M XO VDD_EXT USB (U)SIM1 (U)SIM2 PCM Figure 1: Functional Diagram I2C SPI UART GPIOs 8 2.4. Evaluation Board Quectel provides a complete set of evaluation tools to facilitate the use and testing of EG91 series module.
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LTE Standard Module Series 3 Application Interfaces 3.1. General Description EG91 series module is equipped with 106 LGA pins that can be connected to your cellular application platforms.
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LTE Standard Module Series 3.2. Pin Assignment GND NC VBAT_RF VBAT_RF GND RESERVED (EG91-E)/ANT_DIV (EG91-EX/-NA/-NAL-NAX/-NAXD/NAXDL/-VX) GND NC GND GND ANT_MAIN GND GND The following figure shows the pin assignment of EG91 series module.
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LTE Standard Module Series NOTE 1. 2. 3. 4. 5. PWRKEY output voltage is 0.8 V because of the diode drop in the baseband chipset. Keep all RESERVED pins and unused pins unconnected. GND pins should be connected to ground in the design. Pin 49 is defined as ANT_GNSS on EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX, while it is defined as ANT_DIV on EG91-E. Pin 56 is RESERVED on EG91-E, while it is defined as ANT_DIV on EG91-EX/-NA/-NAL/-NAX/ -NAXD/-NAXDL/-VX. Rx-diversity antenna is not supported on EG91-AUX.
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LTE Standard Module Series Table 4: Pin Description Power Supply Pin Name VBAT_BB VBAT_RF Pin No. 32, 33 52, 53 I/O Description DC Characteristics Comment PI Power supply for the module’s baseband part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V It must be provided with sufficient current up to 0.8 A. Power supply for the module’s RF part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V It must be provided with sufficient current up to 1.8 A in a burst transmission. Vnom = 1.
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LTE Standard Module Series USB_VBUS 8 AI USB connection detec USB_DP 9 AIO USB differential data (+) USB_DM 10 AIO USB differential data (-) I/O Description Vmax = 5.25 V Vmin = 3.0 V Vnom = 5.0 V Typical value: 5.0 V If unused, keep it open. USB 2.0 compliant Require differential impedance of 90 Ω. (U)SIM Interfaces Pin Name Pin No. USIM_GND 47 DC Characteristics Specified ground for (U)SIM card Comment Connect to ground of (U)SIM card connector.
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LTE Standard Module Series For 1.8 V (U)SIM: Vmax = 1.9 V Vmin = 1.7 V USIM2_VDD 87 PO (U)SIM2 card power supply For 3.0 V (U)SIM: Vmax = 3.05 V Vmin = 2.7 V Either 1.8 V or 3.0 V is supported by the module automatically. If unused, keep it open. IOmax = 50 mA For 1.8 V (U)SIM: VILmax = 0.6 V VIHmin = 1.2 V VOLmax = 0.45 V VOHmin = 1.35 V USIM2_DATA 86 DIO (U)SIM2 card data For 3.0 V (U)SIM: VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V For 1.8 V (U)SIM: VOLmax = 0.45 V VOHmin = 1.
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LTE Standard Module Series DCD 38 DO Data carrier detect CTS 36 DO Clear to send RTS 37 DI Request to send VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V DTR 30 DI Data terminal ready Sleep mode control TXD 35 DO Transmit VOLmax = 0.45 V VOHmin = 1.35 V DI Receive VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V RXD 34 If unused, keep it open. 1.8 V power domain. Pulled up by default. Low level wakes up the module.
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LTE Standard Module Series DC Characteristics Pin Name Pin No. I/O Description I2C_SCL 40 OD I2C serial clock (for external codec) I2C_SDA 41 OD I2C serial data (for external codec) Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 24 AI General-purpose ADC interface Voltage range: 0.3 V to VBAT_BB If unused, keep it open. Pin Name Pin No.
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LTE Standard Module Series Other Pins Pin Name W_DISABLE# AP_READY USB_BOOT Pin No. 18 19 75 DC Characteristics Comment Airplane mode control VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. Pull-up by default. At low voltage level, module can enter airplane mode. If unused, keep it open. DI Application processor ready VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open.
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LTE Standard Module Series Table 5: Overview of Operating Modes Mode Normal Operation Details Idle Software is active. The module has registered on network, and it is ready to send and receive data. Talk/Data Network is connected. In this mode, the power consumption is decided by network setting and data transfer rate. Airplane Mode AT+CFUN=4 or W_DISABLE# pin can set the module to enter airplane mode. In this case, RF function will be invalid.
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LTE Standard Module Series Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module.   When EG91 series module has a URC to report, RI signal will wake up the host. See Chapter 3.17 for details about RI behavior. AP_READY will detect the sleep state of host (can be configured to high level or low level detection). See AT+QCFG="apready" for details. 3.5.1.2.
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LTE Standard Module Series   Sending data to EG91 series module through USB will wake up the module. When EG91 series module has a URC to report, the module will send remote wakeup signals via USB bus to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wakeup function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode.
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LTE Standard Module Series The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE 1. 2. 3. Pay attention to the level match shown in dotted line between the module and the host. Refer to document [2] for more details about EG91 series module power management application. For details of AT+QSCLK, see document [3].
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LTE Standard Module Series NOTE 1. 2. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol". The execution of AT+CFUN will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EG91 series module provides four VBAT pins for connection with an external power supply. There are two separate voltage domains for VBAT.   Two VBAT_RF pins for module’s RF part. Two VBAT_BB pins for module’s baseband part.
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LTE Standard Module Series Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 µF with low ESR (ESR = 0.7 Ω) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins.
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LTE Standard Module Series 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2 A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module.
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LTE Standard Module Series Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description Comment PWRKEY 15 Turn on/off the module The output voltage is 0.8 V because of the diode drop in the baseband chipset. When EG91 series module is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin outputting a high level, PWRKEY pin can be released.
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LTE Standard Module Series The power-up scenario is illustrated in the following figure. NOTE 1 VBAT PWRKEY ≥ 500 ms VIH = 0. 8 V VIL ≤ 0.5 V About 100 ms VDD_EXT ≥ 100 ms. After this time, the BOOT_CONFIG pins can be set to high level by external circuit. BOOT_CONFIG & USB_BOOT Pins RESET_N ≥ 10 s STATUS (DO) ≥ 12 s UART I nactive Active ≥ 13 s USB I nactive Active Figure 12: Power-up Timing NOTE 1. 2. 3. Make sure that VBAT is stable before pulling down PWRKEY pin.
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LTE Standard Module Series 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650 ms, the module will execute power-off procedure after the PWRKEY is released. The power-down scenario is illustrated in the following figure. Figure 13: Power-down Timing 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD to turn off the module, which is similar to turning off the module via PWRKEY pin.
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LTE Standard Module Series 3.8. Reset the Module The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a low level voltage for 150–460 ms. Table 8: Pin Definition of RESET_N Pin Name RESET_N Pin No. 17 Description Comment Reset the module Require pull-up resistor to 1.8 V internally. Active low. If unused, keep it open. The recommended circuit is similar to the PWRKEY control circuit.
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LTE Standard Module Series The reset scenario is illustrated in the following figure. VBA T ≤ 460 ms ≥ 150 ms V IH ≥ 1.3 V RESET_N Module Status VIL ≤ 0.5 V Running Resetting Restart Figure 16: Timing of Resetting the Module NOTE 1. 2. Use RESET_N only when turning off the module by AT+QPOWD and PWRKEY pin are failed. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9.
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LTE Standard Module Series USIM1_RST 44 DO (U)SIM1 card reset USIM1_ PRESENCE 42 DI (U)SIM1 card insertion detection 1.8 V power domain. If unused, keep it open. Either 1.8 V or 3.0 V is supported by the module automatically. If unused, keep it open. USIM2_VDD 87 PO (U)SIM2 card power supply USIM2_DATA 86 DIO (U)SIM2 card data USIM2_CLK 84 DO (U)SIM2 card clock USIM2_RST 85 DO (U)SIM2 card reset USIM2_ PRESENCE 83 DI (U)SIM2 card insertion detection 1.8 V power domain.
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LTE Standard Module Series If (U)SIM card detection function is not needed, keep USIM_PRESENCE unconnected. A reference circuit of (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.
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LTE Standard Module Series 3.10. USB Interface EG91 series module contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface acts as slave only, and is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface.
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LTE Standard Module Series A common mode choke L1 is recommended to be added in series between the module and your MCU to suppress EMI spurious transmission. Meanwhile, the 0 Ω resistors (R3 and R4) should be added in series between the module and the test points to facilitate debugging, and the resistors are not mounted by default. To ensure the integrity of USB data trace signal, L1 & R3 & R4 components must be placed close to the module, and also these resistors should be placed close to each other.
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LTE Standard Module Series RTS 37 DI Request to send DTR 30 DI Data terminal ready Sleep mode control TXD 35 DO Transmit RXD 34 DI Receive Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description DBG_TXD 23 DO Debug UART transmit DBG_RXD 22 DI Debug UART receive Comment 1.8 V power domain. If unused, keep it open. The module provides 1.8 V UART interfaces. A voltage-level translator should be used if your application is equipped with a 3.
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LTE Standard Module Series VDD_EXT MCU/ARM 4.7K 1 nF VDD_EXT 10K Module RXD TXD RXD TXD 10K VCC_MCU 1 nF 4.7K VDD_EXT RTS CTS GPIO RTS CTS DTR EINT GPIO GND RI DCD GND Figure 21: Reference Circuit with Transistor Circuit NOTE 1. 2. Transistor circuit solution is not suitable for applications with high baud rates exceeding 460 kbps.
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LTE Standard Module Series EG91 series module supports 16-bit linear data format. The following figures show the primary mode’s timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary mode’s timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK.
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LTE Standard Module Series Table 13: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN 6 DI PCM data input PCM_DOUT 7 DO PCM data output PCM_SYNC 5 DIO PCM data frame sync PCM_CLK 4 DIO PCM data clock I2C_SCL 40 OD I2C serial clock (for external codec) I2C_SDA 41 OD I2C serial data (for external codec) 1.8 V power domain. If unused, keep it open. 1.8 V power domain. In master mode, it is an output signal.
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LTE Standard Module Series 3.13. SPI Interface SPI interface of EG91 series module works as the master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It is dedicated to one-to-one connection, without chip selection. Its operation voltage is 1.8 V with clock rates up to 50 MHz. The following table shows the pin definition of SPI interface. Table 14: Pin Definition of SPI Interface Pin Name Pin No.
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LTE Standard Module Series 3.14. Network Status Indication The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status indication LED. The following tables describe the pin definition and logic level changes of NETLIGHT in different network status. Table 15: Pin Definition of Network Status Indicator Pin Name Pin No. I/O Description Comment NETLIGHT 21 DO Indicate the module’s network activity status 1.
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LTE Standard Module Series 3.15. STATUS The STATUS pin is set as the module’s operation status indicator. It will output high level when the module is powered on. The following table describes the pin definition of STATUS. Table 17: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 20 DO Indicate the module’s operation status 1.8 V power domain. If unused, keep it open. The following figure shows the reference circuit of STATUS. Figure 27: Reference Circuit of STATUS 3.
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LTE Standard Module Series The following table describes the characteristics of ADC interface. Table 19: Characteristics of ADC Interface Parameter Min. ADC0 Voltage Range 0.3 Typ. ADC Resolution Max. Unit VBAT_BB V 15 bits NOTE 1. 2. It is prohibited to supply any voltage to ADC pins when ADC pins are not powered by VBAT. It is recommended to use resistor divider circuit for ADC application. 3.17. Behaviors of RI AT+QCFG="risignaltype","physical" can be used to configure RI behavior.
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LTE Standard Module Series 3.18. USB_BOOT Interface EG91 series module provides a USB_BOOT pin. You can pull up USB_BOOT to VDD_EXT before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface. Table 21: Pin Definition of USB_BOOT Interface Pin Name USB_BOOT Pin No. 75 I/O DI Description Comment Force the module to enter emergency download mode 1.8 V power domain. Active high.
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LTE Standard Module Series Figure 29: Emergency Download Mode Timing NOTE 1. 2. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. When using MCU to control module to enter the emergency download mode, follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8 V before powering up VBAT.
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LTE Standard Module Series 4 GNSS Receiver 4.1. General Description EG91 series module includes a fully integrated global navigation satellite system solution that supports GPS, GLONASS, BeiDou, Galileo and QZSS. EG91 series module supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EG91 series module GNSS engine is switched off. It has to be switched on via AT command.
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LTE Standard Module Series Accuracy (GNSS) @ open sky XTRA enabled 3.4 s CEP-50 Autonomous @ open sky < 2.5 m NOTE 1. 2. 3. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock.
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LTE Standard Module Series 5 Antenna Interfaces EG91 series module antenna interfaces include a main antenna interface and an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/ -NAXDL/-NAL/-VX. The impedance of the antenna port is 50 Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1.
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LTE Standard Module Series 5.1.2.
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LTE Standard Module Series LTE-FDD B66 1710–1780 2110–2180 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 30: Reference Circuit of RF Antenna Interface NOTE 1. 2. 3. 4. EG91-AUX does not support Rx-diversity.
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LTE Standard Module Series 5.2. GNSS Antenna Interface The GNSS antenna interface is only supported on EG91-NA/-VX/-EX/-NAX/-NAXD/-NAXDL/-AUX/-NAL. The following tables show pin definition and frequency specification of GNSS antenna interface. Table 25: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS (EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD /-NAXDL/-VX) 49 AI GNSS antenna 50 Ω impedance Table 26: GNSS Frequency Type Frequency Unit GPS 1575.42 ±1.
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LTE Standard Module Series NOTE 1. 2. An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Reference Design of RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω.
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LTE Standard Module Series Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, the following principles should be complied with in RF layout design:       Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
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LTE Standard Module Series 5.4. Antenna Installation 5.4.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna12 and GNSS antenna. Table 27: Antenna Requirements Type Requirements GNSS 2) Frequency range: 1559–1609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.5 dB Active antenna gain: > 0 dBi Active antenna embedded LNA gain: < 17 dB GSM/WCDMA/LTE VSWR: ≤ 2 Efficiency : > 30 % Max.
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LTE Standard Module Series 5.4.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 37: Mechanicals of U.
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LTE Standard Module Series The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, visit http://www.hirose.com.
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LTE Standard Module Series 6 Reliability,Radio and Electrical Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 28: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.3 V 6.2.
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LTE Standard Module Series burst transmission level on EGSM900 IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900 USB_VBUS USB connection detection 3.0 1.8 2.0 A 5.0 5.25 V 6.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 30: Operating and Storage Temperatures Parameter Min. Typ. Max.
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LTE Standard Module Series Sleep state Idle state GPRS data transfer AT+CFUN=0 (USB disconnected) 1.1 mA GSM DRX = 2 (USB disconnected) 2.0 mA GSM DRX = 5 (USB suspend) 1.6 mA GSM DRX = 9 (USB disconnected) 1.4 mA WCDMA PF = 64 (USB disconnected) 1.8 mA WCDMA PF = 64 (USB suspend) 2.1 mA WCDMA PF = 512 (USB disconnected) 1.2 mA LTE-FDD PF = 64 (USB disconnected) 2.3 mA LTE-FDD PF = 64 (USB suspend) 2.8 mA LTE-FDD PF = 256 (USB disconnected) 1.
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LTE Standard Module Series EDGE data transfer WCDMA data transfer DCS1800 3DL/2UL @ 29.23 dBm 258.0 mA DCS1800 2DL/3UL @ 27.19 dBm 332.4 mA DCS1800 1DL/4UL @ 26.14 dBm 419.1 mA PCS1900 4DL/1UL @ 30.22 dBm 155.0 mA PCS1900 3DL/2UL @ 29.48 dBm 259.5 mA PCS1900 2DL/3UL @ 27.50 dBm 333.1 mA PCS1900 1DL/4UL @ 26.44 dBm 416.8 mA GSM850 4DL/1UL PCL = 8 @ 25.75 dBm 161.8 mA GSM850 3DL/2UL PCL = 8 @ 25.49 dBm 291.8 mA GSM850 2DL/3UL PCL = 8 @ 23.26 dBm 410.
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LTE Standard Module Series LTE data transfer GSM voice call WCDMA voice call WCDMA B2 HSDPA @ 22.14 dBm 557.4 mA WCDMA B2 HSUPA @ 21.18 dBm 539.4 mA WCDMA B5 HSDPA @ 22.6 dBm 588.2 mA WCDMA B5 HSUPA @ 21.45 dBm 545.2 mA WCDMA B8 HSDPA @ 21.92 dBm 578.1 mA WCDMA B8 HSUPA @ 21.93 dBm 592.5 mA LTE-FDD B1 @ 22.96 dBm 777.4 mA LTE-FDD B2 @ 22.79 dBm 634.4 mA LTE-FDD B3 @ 23.09 dBm 697.9 mA LTE-FDD B4 @ 22.83 dBm 704.6 mA LTE-FDD B5 @ 23.05 dBm 657.1 mA LTE-FDD B7 @ 22.
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LTE Standard Module Series Table 32: EG91-E Current Consumption Description Conditions Typ. Unit OFF state Power down 13 μA AT+CFUN=0 (USB disconnected) 1.1 mA GSM DRX = 2 (USB disconnected) 2.0 mA GSM DRX = 5 (USB suspended) 1.9 mA GSM DRX = 9 (USB disconnected) 1.3 mA WCDMA PF = 64 (USB disconnected) 1.7 mA WCDMA PF = 64 (USB suspended) 2.1 mA WCDMA PF = 512 (USB disconnected) 1.1 mA LTE-FDD PF = 64 (USB disconnected) 2.1 mA LTE-FDD PF = 64 (USB suspended) 2.
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LTE Standard Module Series EDGE data transfer WCDMA data transfer LTE data transfer GSM voice call WCDMA voice call DCS1800 1DL/4UL @ 28.86 dBm 467 mA EGSM900 4DL/1UL PCL = 8 @ 27.1 dBm 163 mA EGSM900 3DL/2UL PCL = 8 @ 27.16 dBm 274 mA EGSM900 2DL/3UL PCL = 8 @ 26.91 dBm 383 mA EGSM900 1DL/4UL PCL = 8 @ 26.12 dBm 463 mA DCS1800 4DL/1UL PCL = 2 @ 25.54 dBm 136 mA DCS1800 3DL/2UL PCL = 2 @ 25.68 dBm 220 mA DCS1800 2DL/3UL PCL = 2 @ 25.61 dBm 306 mA DCS1800 1DL/4UL PCL = 2 @ 25.
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LTE Standard Module Series OFF state Sleep state Idle state GPRS data transfer Power down 15 μA AT+CFUN=0 (USB disconnected) 1.3 mA GSM DRX = 2 (USB disconnected) 2.3 mA GSM DRX = 5 (USB suspend) 2.0 mA GSM DRX = 9 (USB disconnected) 1.6 mA WCDMA PF = 64 (USB disconnected) 1.8 mA WCDMA PF = 64 (USB suspend) 2.1 mA WCDMA PF = 512 (USB disconnected) 1.3 mA LTE-FDD PF = 64 (USB disconnected) 2.3 mA LTE-FDD PF = 64 (USB suspend) 2.6 mA LTE-FDD PF = 256 (USB disconnected) 1.
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LTE Standard Module Series EDGE data transfer WCDMA data transfer LTE data transfer GSM voice call WCDMA voice call EGSM900 4DL/1UL PCL = 8 @ 27.29 dBm 169.5 mA EGSM900 3DL/2UL PCL = 8 @ 27.01 dBm 305.06 mA EGSM900 2DL/3UL PCL = 8 @ 26.86 dBm 434 mA EGSM900 1DL/4UL PCL = 8 @ 25.95 dBm 548 mA DCS1800 4DL/1UL PCL = 2 @ 26.11 dBm 135 mA DCS1800 3DL/2UL PCL = 2 @ 25.8 dBm 244 mA DCS1800 2DL/3UL PCL = 2 @ 25.7 dBm 349 mA DCS1800 1DL/4UL PCL = 2 @ 25.6 dBm 455 mA WCDMA B1 HSDPA @ 22.
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LTE Standard Module Series Sleep state Idle state WCDMA data transfer LTE data transfer WCDMA voice call AT+CFUN=0 (USB disconnected) 1.0 mA WCDMA PF = 64 (USB disconnected) 2.2 mA WCDMA PF = 64 (USB suspended) 2.5 mA WCDMA PF = 512 (USB disconnected) 1.4 mA LTE-FDD PF = 64 (USB disconnected) 2.6 mA LTE-FDD PF = 64 (USB suspended) 2.9 mA LTE-FDD PF = 256 (USB disconnected) 1.7 mA WCDMA PF = 64 (USB disconnected) 14.0 mA WCDMA PF = 64 (USB connected) 26.
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LTE Standard Module Series Table 35: EG91-NAL Current Consumption Description Conditions Typ. Unit OFF state Power down 8 μA AT+CFUN=0 (USB disconnected) 0.91 mA LTE-FDD PF=64 (USB disconnected) 2.47 mA LTE-FDD PF=64 (USB suspend) 2.6 mA LTE-FDD PF=256 (USB disconnected) 1.55 mA LTE-FDD PF=64 (USB disconnected) 19.1 mA LTE-FDD PF=64 (USB active) 28.73 mA LTE-FDD B2 @ 23.23dBm 668 mA LTE-FDD B4 @ 23.47dBm 705 mA LTE-FDD B5 @ 23.45dBm 593 mA LTE-FDD B12 @ 23.
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LTE Standard Module Series WCDMA data transfer LTE data transfer WCDMA voice call WCDMA PF = 64 (USB connected) 32.2 mA LTE-FDD PF = 64 (USB disconnected) 14.0 mA LTE-FDD PF = 64 (USB connected) 32.6 mA WCDMA B2 HSDPA @ 21.74 dBm 528 mA WCDMA B2 HSUPA @ 21.47 dBm 536 mA WCDMA B4 HSDPA @ 22.67 dBm 542 mA WCDMA B4 HSUPA @ 22.30 dBm 550 mA WCDMA B5 HSDPA @ 22.63 dBm 523 mA WCDMA B5 HSUPA @ 22.31 dBm 523 mA LTE-FDD B2 @ 23.08 dBm 694 mA LTE-FDD B4 @ 23.
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LTE Standard Module Series Idle state WCDMA data transfer LTE data transfer WCDMA PF = 512 (USB disconnected) 1.6 mA LTE-FDD PF = 64 (USB disconnected) 2.6 mA LTE-FDD PF = 64 (USB suspend) 2.7 mA LTE-FDD PF = 256 (USB disconnected) 1.8 mA WCDMA PF = 64 (USB disconnected) 16.7 mA WCDMA PF = 64 (USB connected) 32.2 mA LTE-FDD PF = 64 (USB disconnected) 14.0 mA LTE-FDD PF = 64 (USB connected) 32.6 mA WCDMA B2 HSDPA @ 21.74 dBm 528 mA WCDMA B2 HSUPA @ 21.
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LTE Standard Module Series Idle state LTE data transfer LTE-FDD PF = 64 (USB disconnected) 2.6 mA LTE-FDD PF = 64 (USB suspend) 2.7 mA LTE-FDD PF = 256 (USB disconnected) 1.8 mA LTE-FDD PF = 64 (USB disconnected) 14.0 mA LTE-FDD PF = 64 (USB connected) 32.6 mA LTE-FDD B2 @ 23.08 dBm 694 mA LTE-FDD B4 @ 23.31 dBm 691 mA LTE-FDD B5 @ 23.23 dBm 586 mA LTE-FDD B12 @ 23.03 dBm 613 mA LTE-FDD B13 @ 23.13 dBm 626 mA LTE-FDD B25 @ 22.96 dBm 689 mA LTE-FDD B26 @ 23.
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LTE Standard Module Series Table 40: GNSS Current Consumption of EG91 Series Module Description Searching (AT+CFUN=0) Tracking (AT+CFUN=0) Conditions Typ. Unit Cold start @ Passive antenna 54 mA Hot start @ Passive antenna 54 mA Lost state @ Passive antenna 53 mA Open sky @ Passive antenna 32 mA 6.5. RF Output Power The following table shows the RF output power of EG91 series module. Table 41: RF Output Power Frequency Bands Max. Output Power Min.
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LTE Standard Module Series In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG91 series module. Table 42: EG91-AUX Conducted RF Receiving Sensitivity Frequency Band Primary Diversity SIMO GSM850 -109.1 dBm - - -102 dBm EGSM900 -109.7 dBm - - -102 dBm DCS1800 -110.
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LTE Standard Module Series Table 43: EG91-E Conducted RF Receiving Sensitivity Frequency Band Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO EGSM900 -108.6 dBm - - -102 dBm DCS1800 -109.4 dBm - - -102 dBm WCDMA B1 -109.5 dBm -110 dBm -112.5 dBm -106.7 dBm WCDMA B8 -109.5 dBm -110 dBm -112.5 dBm -103.7 dBm LTE-FDD B1 (10 MHz) -97.5 dBm -98.3 dBm -101.4 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -98.3 dBm -98.5 dBm -101.5 dBm -93.3 dBm LTE-FDD B7 (10 MHz) -96.
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LTE Standard Module Series LTE-FDD B7 (10 MHz) -97.5 dBm -98.4 dBm -100.3 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -98.7 dBm -99.6 dBm -102.2 dBm -93.3 dBm LTE-FDD B20 (10 MHz) -97 dBm -97.5 dBm -102.2 dBm -93.3 dBm LTE-FDD B28 (10 MHz) -98.2 dBm -99.5 dBm -102 dBm -94.8 dBm Table 45: EG91-NA Conducted RF Receiving Sensitivity Frequency Band Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO WCDMA B2 -110 dBm -110 dBm -112.5 dBm -104.
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LTE Standard Module Series Table 47: EG91-NAX Conducted RF Receiving Sensitivity Frequency Band Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO WCDMA B2 -110 dBm -110 dBm -112.5 dBm -104.7 dBm WCDMA B4 -110 dBm -110 dBm -112.5 dBm -106.7 dBm WCDMA B5 -111 dBm -111 dBm -113 dBm -104.7 dBm LTE-FDD B2 (10 MHz) -98 dBm -99 dBm -102.2 dBm -94.3 dBm LTE-FDD B4 (10 MHz) -97.8 dBm -99.5 dBm -102.2 dBm -96.3 dBm LTE-FDD B5 (10 MHz) -99.4 dBm -100 dBm -102.
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LTE Standard Module Series LTE-FDD B25 (10 MHz) -97.6 dBm -99 dBm -102.2 dBm -92.8 dBm LTE-FDD B26 (10 MHz) -99.1 dBm -99.9 dBm -102.7 dBm -93.8 dBm Table 49: EG91-NAXDL Conducted RF Receiving Sensitivity Frequency Band Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO LTE-FDD B2 (10 MHz) -98 dBm -99 dBm -102.2 dBm -94.3 dBm LTE-FDD B4 (10 MHz) -97.8 dBm -99.5 dBm -102.2 dBm -96.3 dBm LTE-FDD B5 (10 MHz) -99.4 dBm -100 dBm -102.7 dBm -94.
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LTE Standard Module Series Table 51: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 45 %) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND ±5 ±10 kV All Antenna Interfaces ±4 ±8 kV Other Interfaces ±0.5 ±1 kV 6.8.
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LTE Standard Module Series Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTE 1. The module offers the best performance when the internal BB chip stays below 105 °C. When the maximum temperature of the BB chip reaches or exceeds 105 °C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.).
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LTE Standard Module Series 2. For more details about thermal design, see document [7].
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LTE Standard Module Series 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 25±0.15 2.30±0.2 29±0.
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LTE Standard Module Series Pin 1 Figure 42: EG91-E Bottom Dimensions (Top View) EG91_Series_Hardware_Design 93 / 105
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LTE Standard Module Series Pin 1 Figure 43: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX Bottom Dimensions (Top View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard.
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LTE Standard Module Series 7.2. Recommended Footprint 7.45 1.10 7.15 1.95 1.10 2.90 0.50 0.50 Pin 1 4.85 1.00 29±0.15 5.10 1.70 0.20 0.85 1.10 1.90 5.95 4.25 1.10 0.85 1.00 1.00 1.70 0.70 1.70 2.75 0.50 1.15 1.15 0.55 0.50 62x0.7 40x1.0 62x1.15 1.70 1.70 40x1.0 1.70 0.40 1.70 0.40 Figure 44: Recommended Footprint (Top View) NOTE For easy maintenance of this module, please keep about 3 mm between the module and other components on the motherboard.
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LTE Standard Module Series 7.3.
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LTE Standard Module Series Figure 47: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX Bottom View NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.
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LTE Standard Module Series 8 Storage, Manufacturing and Packaging 8.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
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LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.
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LTE Standard Module Series Table 52: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1–3 °C/s Soak time (between A and B: 150 °C and 200 °C) 70–120 s Reflow Zone Max slope 2–3 °C/s Reflow time (D: over 217 °C) 40–70 s Max temperature 235 °C to 246 °C Cooling down slope -1.5 to -3 °C/s Reflow Cycle Max reflow cycle 1 NOTE 1.
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LTE Standard Module Series Figure 49: Tape Dimensions 48.5 Cover tape 13 100 Direction of feed 44.5+0.20 -0.
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LTE Standard Module Series 1083 Carrier tape unfolding Carrier tape packing module Figure 51: Tape and Reel Directions EG91_Series_Hardware_Design 102 / 105
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LTE Standard Module Series 9 Appendix References Table 53: Related Documents Document Name [1] Quectel_UMTS<E_EVB_User_Guide [2] Quectel_EC2x&EG9x_Power_Management_Application_Note [3] Quectel_EG9x_AT_Commands_Manual [4] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_GNSS_Application_Note [5] Quectel_EC2x&EG2x&EG9x&EM05_Series_QCFG_AT_Commands_Manual [6] Quectel_RF_Layout_Application_Note [7] Quectel_LTE_Module_Thermal_Design_Guide [8] Quectel_Module_Secondary_SMT_User_Guide Table 54: Terms and Abbreviations Ab
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LTE Standard Module Series DC-HSPA+ Dual-carrier High Speed Packet Access DCS Data Coding Scheme DFOTA Delta Firmware Upgrade Over-The-Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EDGE Enhanced Data Rates for GSM Evolution EFR Enhanced Full Rate EGSM Enhanced GSM ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate FTP File Transfer Protocol FTPS FTP over SSL GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System
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LTE Standard Module Series Inom Nominal Current LED Light Emitting Diode LGA Land Grid Array LNA Low Noise Amplifier LTE Long Term Evolution M2M Machine to Machine ME Mobile Equipment MIMO Multiple Input Multiple Output MO Mobile Originated MMS Multimedia Messaging Service MS Mobile Station (GSM engine) MCS Modulation and Coding Scheme MQTT Message Queuing Telemetry Transport MSL Moisture Sensitivity Level MT Mobile Terminated NITZ Network Identity and Time Zone NTP Network
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LTE Standard Module Series PING Packet Internet Groper PMIC Power Management IC POS Point of Sale PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized RoHS Restriction of Hazardous Substances RTS Request to Send Rx Receive SAW Surface Acoustic Wave SPI Serial Peripheral Interface SMD Surface Mount Device SMTP Simple Mail Transfer Protocol SMS Short Message Service SSL Secur
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LTE Standard Module Series (U)SIM (Universal) Subscriber Identity Module USB Universal Serial Bus Vmax Maximum Voltage Vnom Nominal Voltage Vmin Minimum Voltage VIHmax Maximum High-evel Input Voltage VIHmin Minimum High-evel Input Voltage VILmax Maximum I Low-level Input Voltage VILmin Minimum Low-level Input Voltage VImax Absolute Maximum Input Voltage VImin Absolute Minimum Input Voltage VOHmin Minimum High-level Output Voltage VOLmax Maximum Low-level Output Voltage VOLmin Min