Product Info

LTE Standard Module Series
EC25 Series Hardware Design
EC25_Series_Hardware_Design 14 / 134
Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module) .......................................... 120118
Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) ........................ 120118
Figure 44: Module Top and Side Dimensions ........................................................................................... 122119
Figure 45: Module Bottom Dimensions (Bottom View) .............................................................................. 123120
Figure 46: Recommended Footprint (Top View) ....................................................................................... 124121
Figure 47: Top View of the Module ............................................................................................................ 125122
Figure 48: Bottom View of the Module ...................................................................................................... 125122
Figure 49: Reflow Soldering Thermal Profile ............................................................................................. 127124
Figure 50: Tape Specifications .................................................................................................................. 128125
Figure 51: Reel Specifications ................................................................................................................... 129126
Figure 52: Tape and Reel Directions ......................................................................................................... 129126