Product Info

LTE Standard Module Series
EC25 Series Hardware Design
EC25_Series_Hardware_Design 121 / 134
1. The module offers the best performance when the internal BB chip stays below 105 °C . When the
maximum temperature of the BB chip reaches or exceeds 105 °C , the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115 °C , the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115 °C . Therefore,
the thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105 °C . Customers can execute AT+QTEMP command and get the
maximum BB chip temperature from the first returned value.
2. For more detailed guidelines on thermal design, please refer to document [7].
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