Users Manual

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design
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The following shows two kinds of heatsink designs for reference and customers can choose one or both
of them according to their application structure.
Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module)
Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
1. The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will
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