Product Info

LTE Standard Module Series
EC25 Mini PCIe Hardware Design
EC25_Mini_PCIe_Hardware_Design
75
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Table 48: GNSS Current Consumption of EC25 Mini PCIe Series Module
6.7. Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
 On customers’ PCB design, please keep placement of the PCI Express Mini Card away from heating
sources.
 Do not place components on the PCB area where the module is mounted, in order to facilitate adding
of heatsink.
 Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heat
dissipation performance.
 The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.
 Add a heatsink on the top of the module and the heatsink should be designed with as many fins as
possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity
should be used between the heatsink and module.
 Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to
PCB.
The following figure shows the referenced heatsink design.
Parameter Description Conditions Typ. Unit
I
VBAT
(GNSS)
Searching
(AT+CFUN=0)
Cold start @Passive Antenna 75.0 mA
Lost state @Passive Antenna 74.0 mA
Tracking
(AT+CFUN=0)
Instrument environment 44.0 mA
Open Sky @Passive Antenna 53.0 mA
Open Sky @Active Antenna 58.0 mA