Product Info

LTE Standard Module Series
EC21_Series_Mini_PCIe_Hardware_Design
69
/ 75
maximum temperature of the BB chip reaches or exceeds 105 °C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115 °C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115 °C. Therefore,
the thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105 °C. Customers can execute AT+QTEMP and get the maximum BB chip
temperature from the first returned value.
2. For more detailed guidelines on thermal design, see document [4].
6.9. Notification
Please follow the principles below in module application.
6.9.1. Coating
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
6.9.2. Cleaning
Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.