Product Info

LTE Standard Module Series
EC21_Series_Mini_PCIe_Hardware_Design
68
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6.8. Thermal Dissipation
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:

On customers’ PCB design, please keep placement of the PCI Express Mini Card away from
heating sources.

Do not place components on the PCB area where the module is mounted, in order to facilitate
adding of heatsink.

Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better
heat dissipation performance.

The reference ground of the area where the module is mounted should be complete, and add
ground vias as many as possible for better heat dissipation.

Add a heatsink on the top of the module and the heatsink should be designed with as many fins as
possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity
should be used between the heatsink and module.

Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to
PCB.
The following figure shows the referenced heatsink design.
Figure 18: Referenced Heatsink Design
1. The module offers the best performance when the internal BB chip stays below 105 °C. When the
NOTE