Product Info

NB-IoT Module Series
BC660K-GL Hardware Design
BC660K-GL_Hardware_Design
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4.4. Reference Design of RF Layout..........................................................................................................38
4.5. Antenna Requirements.........................................................................................................................40
4.6. RF Output Power................................................................................................................................... 41
4.7. RF Receiving Sensitivity.......................................................................................................................42
4.8. Recommended RF Connector for Antenna Installation.................................................................. 43
5 Reliability and Electrical Characteristics..................................................................................................45
5.1. Operating and Storage Temperatures............................................................................................... 45
5.2. Current Consumption............................................................................................................................46
5.3. Electrostatic Discharge......................................................................................................................... 48
6 Mechanical Features.......................................................................................................................................49
6.1. Mechanical Dimensions........................................................................................................................49
6.2. Recommended Footprint......................................................................................................................51
6.3. Top and Bottom Views..........................................................................................................................52
7 Storage, Manufacturing and Packaging....................................................................................................53
7.1. Storage.................................................................................................................................................... 53
7.2. Manufacturing and Soldering...............................................................................................................54
7.3. Tape and Reel Packaging....................................................................................................................55
8 Appendix A References................................................................................................................................. 57