NB-IoT Module Series
BC660K-GL Hardware Design
BC660K-GL_Hardware_Design
6-50
/ 59
3.7
0.7
1.1
17.7
15.8
4.4
1.5
3.5
1.0
4.35
4.3
1.8
1.9
2.25
4.4
±0.15
±0.15
0.7
Figure 28: Module Bottom Dimension (Bottom View)
The package warpage level of the module conforms to JEITA ED-7306 standard.
