Product Info

Automotive Module Series
AG521R-NA QuecOpen
Hardware Design
AG521R-NA_QuecOpen_Hardware_Design 78 / 92
LTE-TDD B14 (10 MHz)
-99.6
-100
-102.8
-93.3 dBm
LTE-TDD B25 (10 MHz)
-98.8
-99
-102
-92.8 dBm
LTE-TDD B26 (10 MHz)
-100
-100.3
-103
-93.8 dBm
LTE-TDD B29 (10 MHz)
-98.5
-101
-102
-93.3 dBm
LTE-TDD B30 (10 MHz)
-97.7
-99
-101
-95.3 dBm
LTE-TDD B66 (10 MHz)
-98.3
-99.5
-101.5
-95.8 dBm
LTE-TDD B71 (10 MHz)
-100.5
-100.3
-103.5
-93.5 dBm
5.7. Electrostatic Discharge
The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD
handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging
procedures must be applied throughout the processing, handling and operation of any application that incorporates
the module.
The following table shows the module electrostatic discharge characteristics.
Table 37: Electrostatic Discharge Characteristics
Tested Points
Contact Discharge
Air Discharge
Unit
VBAT, GND
±8
±10
kV
Antenna Interfaces
±8
±10
kV
Other Interfaces
±0.5
±1
kV
5.8. Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following principles
for thermal consideration:
On customers’ PCB design, please keep placement of the module away from heating sources, especially high
power components such as ARM processor, audio power amplifier, power supply, etc.