Product Info

Automotive Module Series
AG521R-NA QuecOpen Hardware Design
AG521R-NA_QuecOpen_Hardware_Design 84 / 104
7 Storage, Manufacturing and Packaging
7.1. Storage
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements
are shown below.
1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be
35–60 %.
2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.
3. The floor life of the module is 168 hours
1)
in a plant where the temperature is 23 ±5 °C and relative humidity is
below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering
or other high-temperature operations within 24 hours. Otherwise, the module should be stored in an
environment where the relative humidity is less than 10% (e.g. a drying cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the
following circumstances:
⚫ The module is not stored in Recommended Storage Condition;
⚫ Violation of the third requirement above occurs;
⚫ Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
⚫ Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
⚫ The module should be baked for 8 hours at 120 ±5 °C;
⚫ All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a
dry environment such as in a drying oven.
NOTE