Product Info

Automotive Module Series
AG521R-NA QuecOpen Hardware Design
AG521R-NA_QuecOpen_Hardware_Design 78 / 104
The following shows two kinds of heatsink designs for reference and customers can choose one or both of them
according to their application structure.
Heatsink
AG525R-GL QuecOpen Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 37: Referenced Heatsink Design (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
AG525R-GL QuecOpen Module
Shielding Cover
Figure 38: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
1. For better performance, the maximum temperature of the internal BB chip should be kept below 105 °C.
When the maximum temperature of the BB chip reaches or exceeds 105 °C, the module works normal but
provides reduced performance (such as RF output power and data rate). When the maximum BB chip
temperature reaches or exceeds 118 °C, the module will disconnect from the network, and it will recover to
network connected state after the maximum temperature falls below 118 °C. Therefore, the thermal design
should be maximally optimized to make sure the maximum BB chip temperature always maintains below
105 °C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the
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