Product Info

Automotive Module Series
AG521R-NA QuecOpen Hardware Design
AG521R-NA_QuecOpen_Hardware_Design 77 / 104
LTE-TDD B71 (10 MHz)
-100.5
-100.3
-103.5
-93.5 dBm
5.7. Electrostatic Discharge
The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD
handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging
procedures must be applied throughout the processing, handling and operation of any application that incorporates
the module.
The following table shows the module electrostatic discharge characteristics.
Table 37: Electrostatic Discharge Characteristics
Tested Points
Contact Discharge
Air Discharge
Unit
VBAT, GND
±8
±10
kV
Antenna Interfaces
±8
±10
kV
Other Interfaces
±0.5
±1
kV
5.8. Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following principles
for thermal consideration:
⚫ On customers’ PCB design, please keep placement of the module away from heating sources, especially high
power components such as ARM processor, audio power amplifier, power supply, etc.
⚫ Do not place components on the opposite side of the PCB area where the module is mounted, in order to
facilitate adding of heatsink when necessary.
⚫ Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure
better heat dissipation performance.
⚫ The reference ground of the area where the module is mounted should be complete, and add ground vias as
many as possible for better heat dissipation. Through-holes will create better heat dissipation performance.
⚫ Make sure the ground pads of the module and PCB are fully connected.
⚫ According to customers’ application demands, the heatsink can be mounted on the top of the module, or the
opposite side of the PCB area where the module is mounted, or both of them.
⚫ The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a
thermal pad with high thermal conductivity should be used between the heatsink and module/PCB.