Product Info

Automotive Module Series
AG521R-NA QuecOpen Hardware Design
AG521R-NA_QuecOpen_Hardware_Design 69 / 104
Figure 33: Coplanar Waveguide Design on a 2-layer PCB
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
To ensure RF performance and reliability, the following principles should be complied with in RF layout design:
⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to ground.