EC200A Series Hardware Design LTE Standard Module Series Version: 1.0.
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LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
LTE Standard Module Series About the Document Revision History Version Date Author Description - 2021-11-12 Anthony LIU/ Kexiang ZHANG Creation of the document 1.0.
LTE Standard Module Series Contents Safety Information .................................................................................................................................... 3 About the Document ................................................................................................................................ 4 Contents ....................................................................................................................................................
LTE Standard Module Series 4.7. 4.8. ADC Interface ....................................................................................................................... 48 Indication Signal ................................................................................................................... 49 4.8.1. Network Status Indication ............................................................................................ 50 4.8.2. STATUS ........................................................
LTE Standard Module Series Table Index Table 1: Special Marks ............................................................................................................................. 11 Table 2: Brief Introduction of the Module ................................................................................................. 12 Table 3: Wireless Network Type .............................................................................................................. 13 Table 4: Key Features ..........
LTE Standard Module Series Table 42: Recommended Thermal Profile Parameters ............................................................................ 87 Table 43: Carrier Tape Dimension Table (Unit: mm) ................................................................................ 89 Table 44: Plastic Reel Dimension Table (Unit: mm) ............................................................................ 90 Table 45: Related Documents ...............................................................
LTE Standard Module Series Figure Index Figure 2: Pin Assignment (Top View) ....................................................................................................... 17 Figure 3: Sleep Mode Application via UART............................................................................................ 25 Figure 4: Sleep Mode Application with USB Remote Wakeup ................................................................. 26 Figure 5: Sleep Mode Application with MAIN_RI ....................
LTE Standard Module Series Figure 43: Plastic Reel Dimension Drawing ........................................................................................ 89 Figure 44: Packaging Process.................................................................................................................
LTE Standard Module Series 1 Introduction This document defines the EC200A series module and describes its air interfaces and hardware interfaces which are connected with customers’ applications. It can help customers quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use this module to design and to set up mobile applications easily.
LTE Standard Module Series 2 Product Overview EC200A is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity, which provides data connectivity on LTE-FDD, LTE-TDD, HSDPA, HSUPA, HSPA+, WCDMA, EDGE and GPRS network data connection. It also provides voice functionality for your specific applications. EC200A series contains 3 variants: EC200A-CN, EC200A-AU, and EC200A-EU. You can choose a dedicated type based on the region or operator.
LTE Standard Module Series 2.1.
LTE Standard Module Series 2.2. Key Features Table 4: Key Features Features Details Power Supply ⚫ ⚫ Supply voltage: 3.4–4.5 V Typical supply voltage: 3.8 V SMS ⚫ ⚫ ⚫ ⚫ Text and PDU mode. Point-to-point MO and MT. SMS cell broadcast. SMS storage: ME by default. (U)SIM Interface ⚫ Supports (U)SIM card: 1.8/3.
LTE Standard Module Series Network Indication AT Commands Rx-diversity ⚫ Baud rate: 115200 bps. ⚫ NET_MODE and NET_STATUS to indicate network connectivity status. ⚫ Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and Quectel enhanced AT commands.
LTE Standard Module Series ⚫ ⚫ Uplink coding schemes: MCS 1-9 Max 236.8 kbps (DL)/236.8 kbps (UL) ⚫ ⚫ Supports TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CM UX/HTTPS/FTPS/SSL/FILE/MQTT/MMS/SMTP/SMTPS protocols. Supports PAP and CHAP for PPP connections Temperature Range ⚫ ⚫ ⚫ Operating temperature range 1: -35 to +75 °C Extended temperature range 2: -40 to +85 °C Storage temperature range: -40 to +90 °C Firmware Upgrade Use USB interface or DFOTA to upgrade.
LTE Standard Module Series 2.3. Pin Assignment RESERVED GND 55 57 58 56 VBAT_RF VBAT_RF 59 VBAT_BB 60 VBAT_BB 61 STATUS 62 MAIN_RI 63 MAIN_DCD 64 MAIN_CTS 65 MAIN_RTS 66 MAIN_DTR 67 68 MAIN_TXD MAIN_RXD 69 70 USB_DP USB_DM 71 GND USB_VBUS 72 113 RESERVED 114 1 RESERVED The following figure illustrates the pin assignment of the module.
LTE Standard Module Series 2.4. Pin Description The following table shows the DC characteristics and pin descriptions. Table 5: I/O Parameters Definition Type Description AI Analog Input AO Analog Output AIO Analog Input/Output DI Digital Input DO Digital Output DIO Digital Input/Output OD Open Drain PI Power Input PO Power Output Table 6: Pin Description Power Supply Pin Name VBAT_BB VBAT_RF VDD_EXT Pin No.
LTE Standard Module Series GPIO. If unused, keep it open. GND 8, 9, 10,19, 22, 36, 46, 48, 50–54, 56, 72, 85–112 Turn On/Off Pin Name PWRKEY Pin No. 21 I/O DI Description DC Characteristics VBAT power domain. Active low. Turn on/off the module VILmax = 0.5 V RESET_N Comment 1.8 V power domain. Active low after turn-on. 20 DI Reset the module Pin No. I/O Description OD Indicate the module's operation status External pull to 1.8 V. If unused, keep it open.
LTE Standard Module Series (U)SIM Interface Pin Name Pin No. I/O Description DC Characteristics 1.8 V (U)SIM: USIM_VDD 14 PO (U)SIM card power supply Vmax = 1.9 V Vmin = 1.7 V 3.0 V (U)SIM: Vmax = 3.05 V Vmin = 2.7 V Comment Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. 1.8 V (U)SIM: VILmax = 0.6 V VIHmin = 1.2 V VOLmax = 0.45 V VOHmin = 1.35 V USIM_DATA 15 DIO (U)SIM card data 3.0 V (U)SIM: VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.
LTE Standard Module Series SD_SDIO_DATA2 29 DIO SD card SDIO bit 2 SD_SDIO_DATA3 28 DIO SD card SDIO bit 3 SD_SDIO_VDD 34 PO SD card SDIO power supply SD_DET* 23 DI SD card hot-plug detect 1.8 V power domain. If unused, keep it open. Main UART Interface Pin Name Pin No. I/O Description DC Characteristics MAIN_RI 62 DO Main UART ring indication VOLmax = 0.45 V VOHmin = 1.35 V MAIN_DCD 63 DO Main UART data carrier detect VOLmax = 0.45 V VOHmin = 1.
LTE Standard Module Series I2C_SDA 42 OD I2C serial data Pin Name Pin No. I/O Description PCM_SYNC 26 DIO PCM data frame sync external codec. An external 1.8 V pull-up resistor is needed. PCM Interface PCM_CLK 27 DIO PCM clock DC Characteristics Comment VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open.
LTE Standard Module Series USB_BOOT WAKEUP_IN* AP_READY 115 1 2 DI DI DI Forces the module to enter download mode VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V Wake up the module 1.8 V power domain. If unused, keep it open. Application processor ready 1.8 V power domain. If unused, keep it open. VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V W_DISABLE# 4 DI 1.8 V power domain. Active High. It is recommended to reserve test points. Airplane mode control 1.
LTE Standard Module Series 3 Operating Characteristics 3.1. Operating Modes The table below outlines operating modes of the module. Table 7: Overview of Operating Modes Mode Details Idle Software is active. The module is registered on the network and ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate.
LTE Standard Module Series 3.2. Sleep Mode In sleep mode, the module can reduce power consumption to a very low level, the following section describes power saving procedures of EC200A series module. 3.2.1. UART Application If the host communicates with module via UART interface, the following preconditions should be met to enable the module enter sleep mode. ⚫ ⚫ Execute AT+QSCLK=1 to enable sleep mode. Drive MAIN_DTR to high level.
LTE Standard Module Series ⚫ The host’s USB bus, which is connected with the module’s USB interface, enters Suspend state. The following figure shows the connection between the module and the host. Host Module USB_VBUS VDD USB_DP USB_DP USB_DM USB_DM AP_READY GPIO GND GND Figure 3: Sleep Mode Application with USB Remote Wakeup ⚫ ⚫ Sending data to the module through USB will wake up the module.
LTE Standard Module Series 3.2.2.1. USB Application with USB Suspend/Resume and RI Function If the host supports USB Suspend/Resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode. ⚫ ⚫ ⚫ Execute AT+QSCLK=1 to enable the sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. The host’s USB bus, which is connected with the module’s USB interface, enters Suspend state.
LTE Standard Module Series The following figure shows the connection between the module and the host. Module Host GPIO USB_VBUS Power Switch VDD USB_DP USB_DP USB_DM USB_DM MAIN_RI EINT AP_READY GPIO GND GND Figure 5: Sleep Mode Application without Suspend Function Turn on the power switch and supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host. 3.3.
LTE Standard Module Series 3.4. Power Supply 3.4.1. Power Supply Pins The module provides four VBAT pins dedicated to the connection with the external power supply. There are two separate voltage domains for VBAT. ⚫ ⚫ Two VBAT_RF pins for module’s RF part Two VBAT_BB pins for module’s baseband part The following table shows the details of power supply and GND pins. Table 8: Pin Definition of Power Supply Pin Name VBAT_BB VBAT_RF VDD_EXT Pin No.
LTE Standard Module Series MIC29302WU DC_IN VBAT 470 µF ADJ 5 3 1 51K OUT GND IN EN 2 4 100K 1% 330R 4.7K 100 nF VBAT_EN 470 µF 100 nF 47K 1% 47K Figure 6: Reference Design of Power Supply ⚫ NOTE 1. If you use the module that does not support the GSM band, a power supply capable of providing at least 2 A can be used in the design. 2. It is recommended to design switch control for power supply. 3.4.3. Requirements for Voltage Stability The power supply range of the module is from 3.
LTE Standard Module Series structure. The width of VBAT_BB trace should be no less than 1 mm; and the width of VBAT_RF trace should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to ensure the stability of power source, it is suggested that a TVS diode of which reverse stand-off voltage is 4.7 V and peak pulse power is up to 2550 W should be used. The following figure shows the star structure of the power supply.
LTE Standard Module Series 3.5. Turn On 3.5.1. Turn on the Module with PWRKEY Table 9: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module VBAT power domain. Active low. When the module is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY.
LTE Standard Module Series The power-up scenario is illustrated in the following figure. NOTE 1 VBAT ≥ 500 ms PWRKEY VIL ≤ 0.5 V About 5 ms VDD_EXT ≥ 100 ms. After this time, the pin can be set high level by an external circuit. USB_BOOT About 22 ms RESET_N ≥ 10 s STATUS (OD) ≥ 10 s UART I nactive Active ≥ 10 s USB Inactive Active Figure 11: Power-up Timing . NOTE 1. Make sure that VBAT is stable before pulling down PWRKEY pin.
LTE Standard Module Series 3.6.1. Turn off the Module with PWRKEY Driving the PWRKEY to a low-level voltage for at least 650 ms, then the module will execute power-down procedure after the PWRKEY is released. The timing of turning off the module is illustrated in the following figure. VBAT ≥ 650 ms ≥ 2s PWRKEY STATUS (OD) Module Status Running Power-down procedure OFF Figure 12: Timing of Turning off Module 3.6.2.
LTE Standard Module Series RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. Table 10: Pin Definition of RESET Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8 V power domain. Active low after turn-on. The recommended circuit is equal to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. RESET_N ≥ 300 ms 4.
LTE Standard Module Series VBAT ≥ 300 ms RESET_N VIL ≤ 0.5 V Module Status Running Baseband resetting Baseband restart Figure 15: Timing of Resetting Module ⚫ NOTE 1. 2. Please ensure that there is no large capacitance with the max value exceeding 10 nF on PWRKEY and RESET_N pins. RESET_N only resets the internal baseband chip of the module and does not reset the power management chip.
LTE Standard Module Series 4 Application Interfaces 4.1. USB Interface EC200A series provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serve as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface.
LTE Standard Module Series It is recommended to reserve test points for debugging and firmware upgrade in your designs. The following figure shows a reference circuit of USB interface.
LTE Standard Module Series 4.2. USB_BOOT Interface The module provides a USB_BOOT pin. You can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 13: Pin Definition of USB_BOOT Interface Pin Name USB_BOOT Pin No. 115 I/O DI Description Comment Forces the module to enter download mode 1.8 V power domain. Active High.
LTE Standard Module Series NOTE 1 VBAT 500 ms PWRKEY VIL 0.5V About 5 ms VDD_EXT USB_BOOT can be pulled up to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. USB_BOOT About 22 ms RESET_N Figure 18: Timing Sequence for Entering Emergency Download Mode . NOTE 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms.
LTE Standard Module Series (U)SIM card is supported and can be identified automatically by the module. USIM_DATA 15 DIO (U)SIM card data USIM_CLK 16 DO (U)SIM card clock USIM_RST 17 DO (U)SIM card reset USIM_DET 13 DI (U)SIM card hot-plug detect 1.8 V power domain. If unused, keep it open. The module supports (U)SIM card hot-plug via the USIM_DET pin, The function supports low level and high level detections. By default, It is disabled, and can be configured via AT+QSIMDET command.
LTE Standard Module Series USIM_VDD USIM_GND Module USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 100 nF (U)SIM Card Connector VCC RST CLK 0R GND VPP IO 0R 0R 33 pF 33 pF 33 pF GND GND Figure 20: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design. ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Keep (U)SIM card connector as close as possible to the module.
LTE Standard Module Series In short frame mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024, 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4069 kHz PCM_CLK at 16 kHz PCM_SYNC. The module supports a 16-bit linear encoding format. The following figure shows the sequence diagram of short frame mode. (PCM_SYNC = 8 kHz, PCM_CLK = 2048 kHz).
LTE Standard Module Series I2C_SCL 41 OD I2C serial clock I2C_SDA 42 OD I2C serial data Used for external codec. An external 1.8 V pull-up resistor is needed. Clock and mode can be configured by AT command, and the default configuration is short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC.
LTE Standard Module Series 4.5. UART Interface The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. ⚫ ⚫ The main UART interface supports 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps, 921600 bps baud rates, and the baud rate is 115200 bps by default. This interface is used for data transmission and AT command communication. Also, it supports RTS and CTS hardware flow control.
LTE Standard Module Series is recommended. The following figure shows a reference design. VDD_EXT VCCA 120K VCCB 10K 0.1 μF VDD_MCU 0.1 μF OE GND MAIN_RI A1 B1 RI_MCU MAIN_DCD A2 B2 DCD_MCU B3 CTS_MCU MAIN_CTS A3 Translator MAIN_RTS A4 B4 RTS_MCU MAIN_DTR A5 B5 DTR_MCU MAIN_TXD A6 B6 RXD_MCU A7 B7 A8 B8 MAIN_RXD 51K TXD_MCU 51K Figure 23: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information.
LTE Standard Module Series to the host RTS. 4.6. SDIO Interface The module provides one SD card interface which supports SD 3.0 protocol. Table 19: Pin Definition of SD Card Interface Pin Name Pin No.
LTE Standard Module Series In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with: ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ The voltage range of SD card power supply VDD_3V is 2.7–3.6 V and a sufficient current up to 0.8 A should be provided. The maximum output current of SD_SDIO_VDD is 50 mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card.
LTE Standard Module Series For more details about the AT command, please refer to document [2]. The resolution of the ADC is up to 12 bits. The following table describes the characteristic of the ADC interface. Table 21: Characteristics of ADC Interface Name Min. Typ. Max. Unit ADC0 Voltage Range 0 - VBAT_BB V ADC1 Voltage Range 0 - VBAT_BB V ADC Resolution - 12 - bits NOTE 1. The input voltage of ADC should not exceed its corresponding voltage range. 2.
LTE Standard Module Series 4.8.1. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two network indication pins: NET_MODE and NET_STATUS. The following tables describe pin definition and logic level changes in different network status.
LTE Standard Module Series turned on normally, the STATUS will present the low state. Except for this, the STATUS will present high-impedance state. The following figure shows different circuit designs of STATUS, and you can choose either one according to the application demands. VBAT VDD_MCU 33 K 2.2 K STATUS MCU_GPIO Module STATUS Module Figure 27: Reference Circuits of STATUS NOTE The status pin cannot be used as indication of module shutdown status when VBAT is removed. 4.9.
LTE Standard Module Series Table 24: Behaviors of the MAIN_RI State Response Idle MAIN_RI keeps at high level URC MAIN_RI outputs 120 ms low pulse when a new URC returns The MAIN_RI behavior can be changed via AT+QCFG. Please refer to document [2] for details.
LTE Standard Module Series 5 RF Specifications 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 25: Pin Definition of Cellular Network Interface Pin Name Pin No. I/O Description Comment ANT_DRX 35 AI Diversity antenna interface 50 Ω impedance. ANT_MAIN 49 AIO Main antenna interface ⚫ NOTE Only passive antennas are supported.
LTE Standard Module Series LTE-FDD B1 1920–1980 2110–2170 LTE-FDD B3 1710–1785 1805–1880 LTE-FDD B5 824–849 869–894 LTE-FDD B8 880–915 925–960 LTE-TDD B34 2010–2025 2010–2025 LTE-TDD B38 2570–2620 2570–2620 LTE-TDD B39 1880–1920 1880–1920 LTE-TDD B40 2300–2400 2300–2400 LTE-TDD B41 2535–2675 2535–2675 ⚫ NOTE B41 only support 140M (2535–2675 MHz).
LTE Standard Module Series LTE FDD B2 1850–1910 1930–1990 LTE-FDD B3 1710–1785 1805–1880 LTE FDD B4 1710–1755 2110–2155 LTE-FDD B5 824–849 869–894 LTE-FDD B7 2500–2570 2620–2690 LTE-FDD B8 880–915 925–960 LTE-FDD B28 703–748 758–803 LTE-FDD B66 1710–1780 2110–2180 LTE-TDD B40 2300–2400 2300–2400 Table 28: Operating Frequency of EC200A-EU Operating Frequency Transmit (MHz) Receive (MHz) EGSM900 880–915 925–960 DCS1800 1710–1785 1805–1880 WCDMA B1 1922–1978 2112–2168 WC
LTE Standard Module Series LTE-TDD B40 2300–2400 2300–2400 LTE-TDD B41 2535–2675 2535–2675
LTE Standard Module Series 5.1.2. Tx Power The following table shows the RF output power of the module. Table 29: Tx Power . Frequency Max.
LTE Standard Module Series Table 30: Conducted RF Receiving Sensitivity of EC200A-CN Primary Diversity SIMO 3GPP Requirement (SIMO) EGSM900 -109 - - -102 dBm DCS1800 -107 - - -102 dBm WCDMA B1 -109.4 - - -106.7 dBm WCDMA B5 -109.7 - - -104.7 dBm WCDMA B8 -110.2 - - -103.7 dBm LTE-FDD B1 -98.1 -98.4 -101.3 -96.3 dBm LTE-FDD B3 -97.1 -98.1 -100.8 -93.3 dBm LTE-FDD B5 -98.9 -99.7 -101.9 -94.3 dBm LTE-FDD B8 -97.4 -99.2 -101.9 -93.3 dBm LTE-TDD B34 -96.6 -98.
LTE Standard Module Series WCDMA B2 -107.7 - - -104.7 dBm WCDMA B4 -109.2 - - -106.7 dBm WCDMA B5 -110.7 - - -104.7 dBm WCDMA B8 -110.2 - - -103.7 dBm LTE-FDD B1 -97.8 -97.8 -101 -96.3 dBm LTE FDD B2 -96.1 -97.8 -100.2 -94.3 dBm LTE-FDD B3 -96.7 -97.5 -100.9 -93.3 dBm LTE FDD B4 -96.6 -97.4 -101.1 -96.3 dBm LTE-FDD B5 -98.2 -99.2 -101.7 -94.3 dBm LTE-FDD B7 -95.8 -97.3 -99.9 -94.3 dBm LTE-FDD B8 -96.9 -98.6 -100.2 -93.3 dBm LTE-FDD B28 -98.5 -99.
LTE Standard Module Series LTE-FDD B7 -94.4 -95.8 -98 -94.3 dBm LTE-FDD B8 -96.7 -98.9 -100.1 -93.3 dBm LTE-FDD B20 -98.1 -99.3 -101.4 -93.3 dBm LTE-FDD B28 -98.9 -99.5 -102.6 -94.8 dBm LTE-TDD B38 -96.5 -95.2 -99.3 -96.3 dBm LTE-TDD B40 -97.3 -97.3 -100.5 -96.3 dBm LTE-TDD B41 -94.9 -95.1 -97.8 -94.3 dBm 5.1.4. Reference Design The module provides two RF antenna interfaces for antenna connection.
LTE Standard Module Series 5.2. Reference Design of RF Routing For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance.
LTE Standard Module Series Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
LTE Standard Module Series traces on adjacent layers. For more details about RF layout, please refer to document [3]. 5.3. Requirements for Antenna Design Table 33: Requirements for Antenna Design Antenna Type Requirements GSM/UMTS/LTE VSWR: ≤ 2 Efficiency: > 30 % Gain: 1dBi Max. input power: 50 W Input impedance: 50 Ω Cable insertion loss: < 1 dB:LB(< 1 GHz) < 1.5 dB:MB(1~2.3 GHz) < 2 dB:HB(> 2.
LTE Standard Module Series 5.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.
LTE Standard Module Series The following figure describes the space factor of mated connector. Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com.
LTE Standard Module Series 6 Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 34: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 5.5 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB - 0.8 A Peak Current of VBAT_RF - 1.8 A Voltage on Digital Pins -0.3 2.
LTE Standard Module Series 6.2. Power Supply Ratings Table 35: The Module’s Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. 3.4 3.8 4.5 V Voltage drop during transmitting burst Maximum power control level at EGSM 900 0 0 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level at EGSM 900 - 1.8 2.
LTE Standard Module Series 6.3. Power Consumption Table 36: The Module Power Consumption EC200A-CN Description Conditions Typ. Unit OFF state Power down 11 uA AT+CFUN=0 (USB disconnected) 0.86 mA EGSM900 @ DRX = 2 (USB disconnected) 1.71 mA EGSM900 @ DRX = 5 (USB disconnected) 1.27 mA EGSM900 @ DRX = 5 (USB suspend) 1.43 mA EGSM900 @ DRX = 9 (USB disconnected) 1.14 mA DCS1800 @ DRX = 2 (USB disconnected) 1.70 mA DCS1800 @ DRX = 5 (USB disconnected) 1.
LTE Standard Module Series LTE-FDD @ PF = 256 (USB disconnected) 1.06 mA LTE-TDD @ PF = 32 (USB disconnected) 2.09 mA LTE-TDD @ PF = 64 (USB disconnected) 1.48 mA LTE-TDD @ PF = 64 (USB suspend) 1.64 mA LTE-TDD @ PF = 128 (USB disconnected) 1.20 mA LTE-TDD @ PF = 256 (USB disconnected) 1.06 mA EGSM900 @ DRX = 5 (USB disconnected) 20.35 mA EGSM900 @ DRX = 5 (USB connected) 36.52 mA WCDMA @ PF = 64 (USB disconnected) 20.99 mA WCDMA @ PF = 64 (USB connected) 37.
LTE Standard Module Series EGSM900 1DL/4UL @ 22.87 dBm 359.2 mA DCS1800 4DL/1UL @ 25.66 dBm 119.4 mA DCS1800 3DL/2UL @ 25.50 dBm 214.1 mA DCS1800 2DL/3UL @ 23.95 dBm 289.1 mA DCS1800 1DL/4UL @ 21.93 dBm 344.8 mA WCDMA B1 HSDPA @ 22.06 dBm 511.97 mA WCDMA B5 HSDPA @ 21.68 dBm 443.02 mA WCDMA B8 HSDPA @ 21.64 dBm 483.22 mA WCDMA B1 HSUPA @ 21.30 dBm 489.72 mA WCDMA B5 HSUPA @ 20.02 dBm 405.29 mA WCDMA B8 HSUPA @ 21.03 dBm 451.78 mA LTE-FDD B1 @ 22.78 dBm 563.
LTE Standard Module Series WCDMA voice call DCS1800 PCL = 15 @ -0.43 dBm 46.8 mA WCDMA B1 @ 22.77 dBm 557.69 mA WCDMA B5 @ 22.42 dBm 483.34 mA WCDMA B8 @ 22.43 dBm 529.50 mA EC200A-AU Description Conditions Typ. Unit OFF state Power down 10 uA AT+CFUN=0 (USB disconnected) 0.95 mA EGSM900 @ DRX = 2 (USB disconnected) 1.67 mA EGSM900 @ DRX = 5 (USB disconnected) 1.29 mA EGSM900 @ DRX = 5 (USB suspend) TBD mA EGSM900 @ DRX = 9 (USB disconnected) 1.
LTE Standard Module Series LTE-FDD @ PF = 256 (USB disconnected) TBD mA LTE-TDD @ PF = 32 (USB disconnected) TBD mA LTE-TDD @ PF = 64 (USB disconnected) TBD mA LTE-TDD @ PF = 64 (USB suspend) TBD mA LTE-TDD @ PF = 128 (USB disconnected) TBD mA LTE-TDD @ PF = 256 (USB disconnected) TBD mA EGSM900 @ DRX = 5 (USB disconnected) 62.62 mA EGSM900 @ DRX = 5 (USB connected) 38.93 mA WCDMA @ PF = 64 (USB disconnected) 14.55 mA WCDMA @ PF = 64 (USB connected) 39.
LTE Standard Module Series DCS1800 1DL/4UL @ 25.85 dBm 351 mA PCS1900 4DL/1UL @ 27.61 dBm 218 mA PCS1900 3DL/2UL @ 27.33 dBm 361 mA PCS1900 2DL/3UL @ 27.17 dBm 435 mA PCS1900 1DL/4UL @ 26.20 dBm 427 mA GSM850 4DL/1UL @ 26.38 dBm 133 mA GSM850 3DL/2UL @ 24.64 dBm 217 mA GSM850 2DL/3UL @ 22.53 dBm 283 mA GSM850 1DL/4UL @ 20.50 dBm 350 mA EGSM900 4DL/1UL @ 26.74 dBm 136 mA EGSM900 3DL/2UL @ 24.71 dBm 223 mA EGSM900 2DL/3UL @ 22.57 dBm 288 mA EGSM900 1DL/4UL @ 20.
LTE Standard Module Series LTE data transfer WCDMA B8 HSDPA @ 21.64 dBm 534 mA WCDMA B1 HSUPA @ 21.99 dBm 484 mA WCDMA B2 HSUPA @ 21.61 dBm 535 mA WCDMA B4 HSUPA @ 20.68 dBm 501 mA WCDMA B5 HSUPA @ 21.42 dBm 481 mA WCDMA B8 HSUPA @ 21.45 dBm 523 mA LTE-FDD B1 @ 22.88 dBm TBD mA LTE-FDD B3 @ 23.63 dBm TBD mA LTE-FDD B5 @ 22.82 dBm TBD mA LTE-FDD B8 @ 22.80 dBm TBD mA LTE-TDD B34 @ 23.00 dBm TBD mA LTE-TDD B38 @ 22.45 dBm TBD mA LTE-TDD B39 @ 23.
LTE Standard Module Series WCDMA B8 @ 22.61 dBm 593 mA EC200A-EU Description Conditions Typ. Unit OFF state Power down 10 uA AT+CFUN=0 (USB disconnected) 0.78 mA EGSM900 @ DRX = 2 (USB disconnected) 1.50 mA EGSM900 @ DRX = 5 (USB disconnected) 1.12 mA EGSM900 @ DRX = 5 (USB suspend) 1.28 mA EGSM900 @ DRX = 9 (USB disconnected) 1.01 mA DCS1800 @ DRX = 2 (USB disconnected) 1.50 mA DCS1800 @ DRX = 5 (USB disconnected) 1.11 mA DCS1800 @ DRX = 5 (USB suspend) 1.
LTE Standard Module Series LTE-TDD @ PF = 64 (USB suspend) 1.45 mA LTE-TDD @ PF = 128 (USB disconnected) 1.02 mA LTE-TDD @ PF = 256 (USB disconnected) 0.90 mA EGSM900 @ DRX = 5 (USB disconnected) 18.06 mA EGSM900 @ DRX = 5 (USB connected) 32.65 mA WCDMA @ PF = 64 (USB disconnected) 18.57 mA WCDMA @ PF = 64 (USB connected) 33.17 mA LTE-FDD @ PF = 64 (USB disconnected) 18.31 mA LTE-FDD @ PF = 64 (USB connected) 33.11 mA LTE-TDD @ PF = 64 (USB disconnected) 18.
LTE Standard Module Series DCS1800 2DL/3UL @ 24.24 dBm 289 mA DCS1800 1DL/4UL @ 22.10 dBm 360 mA WCDMA B1 HSDPA @ 21.99 dBm 520 mA WCDMA B5 HSDPA @ 21.76 dBm 474 mA WCDMA B8 HSDPA @ 21.81 dBm 496 mA WCDMA B1 HSUPA @ 21.21 dBm 504 mA WCDMA B5 HSUPA @ 21.13 dBm 454 mA WCDMA B8 HSUPA @ 21.49 dBm 497 mA LTE-FDD B1 @ 23.61 dBm 607 mA LTE-FDD B3 @ 23.71 dBm 636 mA LTE-FDD B5 @ 23.70 dBm 568 mA LTE-FDD B7 @ 23.56 dBm 813 mA LTE-FDD B8 @ 24.11 dBm 591 mA LTE-FDD B20 @ 23.
LTE Standard Module Series WCDMA voice call WCDMA B5 @ 22.26 dBm 496 mA WCDMA B8 @ 22.25 dBm 533 mA 6.4. Digital I/O Characteristic Table 37: 1.8 V I/O Requirements Parameter Description Min. Max. Unit VIH Input high voltage 1.2 2.0 V VIL Input low voltage -0.3 0.6 V VOH Output high voltage 1.35 1.8 V VOL Output low voltage -0.3 0.45 V Table 38: (U)SIM 1.8 V I/O Requirements Parameter Description Min. Max. Unit USIM_VDD Power supply 1.7 1.
LTE Standard Module Series VIL Input low voltage -0.3 1.0 V VOH Output high voltage 2.55 3.0 V VOL Output low voltage -0.3 0.45 V 6.5. ESD If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent. Thus, please take proper ESD countermeasures and handling methods.
LTE Standard Module Series 6.6. Operating and Storage Temperatures Table 41: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit -35 +25 +75 °C Extended Operating Temperature Range 4 -40 - +85 °C Storage temperature range -40 - +95 °C Operating Temperature Range 3 3 Within operating temperature range, the module is 3GPP compliant.
LTE Standard Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 7.1.
LTE Standard Module Series Figure 37: Module Bottom Dimensions View (Unit: mm) ⚫ NOTE The flatness of EC200A series module of Remote Communication meets the requirements of JEITA ED-7306 standard.
LTE Standard Module Series 7.2. Recommended Footprint Figure 38: Recommended Footprint (Bottom View) . NOTE For convenient maintenance of the module, please keep about 3 mm between the module and other components on the host PCB.
LTE Standard Module Series 7.3. Top and Bottom Views Figure 39: Top and Bottom View of the Module NOTE These are renderings of the module. For authentic appearance, please refer to the module that you receive from Quectel.
LTE Standard Module Series 8 Storage, Manufacturing and Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed package. MSL of the module is rated as 3, and its storage restrictions are shown as below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
LTE Standard Module Series put in a dry environment such as in a drying oven. NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.
LTE Standard Module Series 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18 – 0.20 mm. For more details, please refer to document [4].
LTE Standard Module Series Soak time (between A and B: 150 °C and 200 °C) 70 to 120 s Reflow Zone Max slope 2 to 3 °C/s Reflow time (D: over 217 °C) 45 to 70 s Max temperature 235 to 246 °C Cooling down slope -1.5 ~ -3 °C/s Reflow Cycle Max reflow cycle 1 NOTE 1. 2. 3. 4. 5.
LTE Standard Module Series Figure 41: Carrier Tape Dimension Drawing Table 43: Carrier Tape Dimension Table (Unit: mm) W P T A0 B0 K0 K1 F E 44 44 0.35 32.5 29.5 3.0 3.8 20.2 1.75 8.3.2.
LTE Standard Module Series Table 44: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 W 330 100 44.5 8.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. One plastic reel can load 250 modules. Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, then vacuumize it.
LTE Standard Module Series 9 Appendix References Table 45: Related Documents Document Name [1] Quectel_UMTS<E_EVB_User_Guide [2] Quectel_EC200x&EG912Y_Series_AT_Commands_Manual [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_Secondary_SMT_Application_Note Table 46: Terms and Abbreviations Abbreviation Description AMR Adaptive Multi-Rate BeiDou BeiDou Navigation Satellite System bps Bytes per second CDMA Code Division Multiple Access CS Coding Scheme CTS Clear To Send DRX Disco
LTE Standard Module Series EVB Evaluation Board FDD Frequency Division Duplexing FR Full Rate FTP File Transfer Protocol FTPS FTP over SSL GMSK Gaussian Filtered Minimum Shift Keying GND Ground GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communications HR Half Rate HSDPA High Speed Downlink Packet Access HTTPS Hypertext Transfer Protocol Secure LGA Land Grid Array LTE Long Term Evolution MCS Modulation and Coding Scheme
LTE Standard Module Series QPSK Quadrature Phase Shift Keying RF Radio Frequency RoHS Restriction of Hazardous Substances RTS Request To Send SDIO Secure Digital Input and Output Card SMS Short Message Service SMTP Simple Mail Transfer Protocol SMTPS Simple Mail Transfer Protocol Secure SSL Secure Sockets Layer TCP Transmission Control Protocol TDD Time Division Duplexing UDP User Datagram Protocol UMTS Universal Mobile Telecommunications System USB Universal Serial Bus (U)SIM
LTE Standard Module Series WCDMA Wideband Code Division Multiple Access 10 Warnings sentences 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.
LTE Standard Module Series In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
LTE Standard Module Series technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation,maximum antenna gain (including cable loss)must not exceed: SM850/WCDMA Band5/LTE Band 5:≤ 7.