Service Guide
Table Of Contents
- Safety Information
- About the Document
- Contents
- Table Index
- Figure Index
- 1 Introduction
- 2 Product Overview
- 3 Operating Characteristics
- 4 Application Interfaces
- 5 Antenna Interfaces
- 6 Electrical Characteristics & Reliability
- 7 Mechanical Information
- 8 Storage, Manufacturing & Packaging
- 9 Appendix References
LTE Standard Module Series
EG915U_Series_Hardware_Design 78 / 91
7.3 Recommended Footprint
Figure 38: Recommended Footprint (TOP View)
.
1. For easy maintenance of the module, keep about 3 mm between the module and other components
on the motherboard.
2. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least
1.2 mm
NOTE