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EG915U Series

Hardware Design

LTE Standard Module Series

Version: 1.0

Date: 2021-11-23

Status: Released

Summary of content (92 pages)

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EG915U Series Hardware Design LTE Standard Module Series Version: 1.
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LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
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LTE Standard Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”).
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LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
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LTE Standard Module Series About the Document Revision History Version Date Author Description - 2021-11-23 Len CHEN/Reuben WANG/ Frank WANG/Ailsa WANG Creation of the document 1.
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LTE Standard Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents .......................................................................................................................................................
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LTE Standard Module Series 4.1.3. Receiver Interface Design .............................................................................................. 39 4.2. USB Interface .......................................................................................................................... 40 4.3. USB_BOOT Interface .............................................................................................................. 42 4.4. (U)SIM Interface ................................................
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LTE Standard Module Series Table Index Table 1: Special Mark ................................................................................................................................. 10 Table 2: Wireless Network Type ..................................................................................................................11 Table 3: I/O Parameters Definition .............................................................................................................
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LTE Standard Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 14 Figure 2: EG915U Series Module Pin Assignment (Top View) .................................................................. 15 Figure 3: Sleep Mode Application via UART ..............................................................................................
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LTE Standard Module Series Figure 42: Reel Specifications ................................................................................................................... 83 Figure 43: Tape and Reel Directions ..........................................................................................................
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LTE Standard Module Series 1 Introduction This document defines the EG915U series module and describes its air interfaces and hardware interfaces which are connected with relate to customers’ applications. It can help customers quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use this module to design and to set up mobile applications easily. 1.1.
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LTE Standard Module Series 2 Product Overview EG915U series module is an LTE-FDD, LTE-TDD and GSM wireless communication module, which provides data connectivity on LTE-FDD, LTE-TDD and GPRS networks. It also provides voice functionality, Bluetooth and Wi-Fi Scan 1 to meet your specific application demands. Related information and details are listed in the table below: Table 2: Brief Introduction of the Module Categories Packaging and pins number 126-pin; LGA Dimensions (23.6 ±0.2 ) mm × (19.9 ±0.
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LTE Standard Module Series 2.2. Key Features The following table describes the detailed features of EG915U series module.
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LTE Standard Module Series ⚫ GSM Features FDD: Max 10 Mbps (DL)/5 Mbps (UL). GPRS: ⚫ Supports GPRS multi-slot class 12 ⚫ Coding scheme: CS-1/CS-2/CS-3/CS-4 ⚫ Max 85.6 Kbps (DL)/85.
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LTE Standard Module Series Position Fixing ⚫ Support Wi-Fi Scan Temperature Range ⚫ ⚫ ⚫ Operation temperature range: -35 to +75 °C 4 Extended temperature range: -40 to +85 °C 5 Storage temperature range: -40 to +90 °C Firmware Upgrade ⚫ USB interface and DFOTA RoHS ⚫ All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts.
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LTE Standard Module Series 2.4. Pin Assignment GND 50 51 RESERVED 52 VBAT_RF 53 VBAT_RF 54 GND 55 GND 56 ANT_BT/WIFI_SCAN 57 RESERVED 58 GND 59 GND 60 ANT_MAIN GND 61 GND 62 The following figure illustrates the pin assignment of the module.
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LTE Standard Module Series 2.5. Pin Description The following tables show the pin definition of the module. Table 3: I/O Parameters Definition Type Description AI Analog Input AO Analog Output AIO Analog Input/Output DI Digital Input DO Digital Output DIO Digital Input/Output OD Open Drain PI Power Input PO Power Output Table 4: Pin Description Power Supply Pin Name VBAT_BB VBAT_RF VDD_EXT Pin No.
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LTE Standard Module Series If unused, keep it open. Power On/Off Pin Name Pin No. I/O Description PWRKEY 15 DI Turn on/off the module DC Characteristics VBAT power domain. VILmax = 0.5 V RESET_N 17 DI Reset the module I/O Description Comment VBAT power domain. If unused, keep it open. Indication Interfaces Pin Name STATUS Pin No. 20 DO Indicate the module's operation status DC Characteristics Comment VOHmin = 1.35 V VOLmax = 0.45 V 1.8 V power domain.
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LTE Standard Module Series Vmin = 1.7 V For 3.0 V (U)SIM: Vmax = 3.05 V Vmin = 2.7 V can be identified automatically by the module. For 1.8 V (U)SIM: VILmax = 0.6 V VIHmin = 1.26 V VOLmax = 0.45 V VOHmin = 1.35 V USIM1_DATA 45 DIO (U)SIM1 card data For 3.0 V (U)SIM: VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V For 1.8 V (U)SIM: VOLmax = 0.45 V VOHmin = 1.35 V USIM1_CLK 46 DO (U)SIM1 card clock For 3.0 V (U)SIM: VOLmax = 0.45 V VOHmin = 2.55 V For 1.8 V (U)SIM: VOLmax = 0.
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LTE Standard Module Series 1.8 V (U)SIM： VILmax = 0.6 V VIHmin = 1.26 V VOLmax = 0.45 V VOHmin = 1.35 V USIM2_DATA 86 DIO (U)SIM2 card data 3.0 V (U)SIM： VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM： VOLmax = 0.45 V VOHmin = 1.35 V USIM2_CLK 84 DO (U)SIM2 card clock 3.0 V (U)SIM： VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM： VOLmax = 0.45 V VOHmin = 1.35 V USIM2_RST 85 DO (U)SIM2 card reset 3.0 V (U)SIM： VOLmax = 0.45 V VOHmin = 2.
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LTE Standard Module Series MAIN_DCD 38 DO Main UART data carrier detect VOLmax = 0.45 V VOHmin = 1.35 V MAIN_TXD 35 DO Main UART transmit VOLmax = 0.45 V VOHmin = 1.35 V MAIN_RI 39 DO Main UART ring indication VOLmax = 0.45 V VOHmin = 1.35 V DI Main UART data terminal ready VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V I/O Description DC Characteristics comment Auxiliary UART transmit VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open.
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LTE Standard Module Series connection of multiple peripherals except for codec IC PCM Interface Pin Name PCM_SYNC PCM_CLK Pin No. 5 4 I/O DI DI Description DC Characteristics PCM data frame sync VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V PCM clock VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V PCM_DIN 6 DI PCM data input VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V PCM_DOUT 7 DO PCM data output VOLmax = 0.45 V VOHmin = 1.
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LTE Standard Module Series SPI_DIN 88 DI SPI master mode input VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V SPI_DOUT 64 DO SPI master mode output VOLmax = 0.45 V VOHmin = 1.35 V Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 24 AI ADC1 2 AI General-purpose ADC interface Voltage range: 0.1 V to VBAT If unused, keep it open. DC Characteristics ADC Interface Analog Audio Interfaces Pin Name Pin No.
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LTE Standard Module Series PSM_IND PSM_EINT DO Indicate the module’s power saving mode 96 DI External interrupt pin; wake up the module from PSM Pin No. I/O Description 1 Other Interfaces Pin Name W_DISABLE# AP_READY 18 19 DI DI Airplane mode control Application processor ready DC Characteristics Comment VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V 1.8 V power domain. Pulled up by default. When it is in low voltage level, the module can enter airplane mode.
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LTE Standard Module Series RESERVED NOTE 1. 11, 12, 13, 14, 16, 49, 51, 57, 65, 66, 78, 92, 93, 94, 95, 97, 98, 99, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113, 114, 115, 116, 117, 118, 123, 124, 125 The functions of PSM and GRFC are under development and it is not recommended to use them right now, please consult Quectel Technical Support for details. 5.
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LTE Standard Module Series 3 Operating Characteristics EG915U series module have a total of 126 pins, The subsequent chapters will provide detailed descriptions of the following interfaces. ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Power supply (U)SIM interface USB interface UART interfaces SPI interface PCM and I2C interfaces Analog audio interfaces ADC interfaces PSM interface* Status indication USB_BOOT interface 3.1.
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LTE Standard Module Series level. In this mode, the module can still receive paging, SMS, voice call and TCP/UDP data from network normally. In this mode, the VBAT power supply is constantly turned on and the software stops working. Power Down Mode 3.2. Sleep Mode The module is able to reduce its current consumption to an ultra-low value in the sleep mode. The following section describes power saving procedures of EG915U series module. 3.2.
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LTE Standard Module Series 3.2.2. USB Application Scenario If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions can make the module enter the sleep mode. ⚫ ⚫ ⚫ Execute AT+QSCLK=1 to enable the sleep mode. Ensure the MAIN_DTR is kept at high level or kept open. Ensure the host’s USB Bus, which is connected with the module’s USB interface, enters suspend state. The following figure shows the connection between the module and the host. 3.2.2.1.
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LTE Standard Module Series 1. Under Linux OS, USB support Suspend, under Windows OS nonsupport Suspend. 2. Pay attention to the level match shown in dotted line between the module and the host.
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LTE Standard Module Series 3.2.2.2. USB Application with USB Suspend/Resume and MAIN_RI Wakeup Function If the host supports USB Suspend/Resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. The following figure shows the connection between the module and the host.
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LTE Standard Module Series 3.3. Airplane Mode When the module enters into airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. 3.3.1. Hardware The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default and AT+QCFG=“airplanecontrol”,1 can be used to enable the function. Driving it low will set the module enter airplane mode. 3.3.2.
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LTE Standard Module Series 91, 100, 101, 102 3.4.2. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of the module should be able to provide sufficient current of 3.0 A at least. If the voltage drops between input and output is not too high, it is suggested that an LDO should be used to supply power to the module.
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LTE Standard Module Series Figure 7: Power Supply Limits during Burst Transmission To decrease the voltage drop, use bypass capacitors of about 100 µF with low ESR (ESR = 0.7 Ω) and reserve a multi-layer ceramic chip (MLCC) capacitor array due to their ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT_SENSE and VBAT_RF pins.
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LTE Standard Module Series simple reference circuit is illustrated in the following figure. PWRKEY 2s 4.7K 10 nF Turn-on pulse 47K Figure 9: Turing on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When you are pressing the key, electrostatic strike may be generated from finger. Therefore, you must place a TVS component nearby the button for ESD protection. A reference circuit is shown in the following figure.
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LTE Standard Module Series Note 1 VBAT PWRKEY ≥2s VIL ≤ 0.5 V About 1.15 s VDD_EXT RESET_N ≥4s UART I nactive Active ≥ 2.23 s USB I nactive Active Figure 11: Power-up Timing . NOTE 1. Make sure that the VBAT is stable before pulling down PWRKEY pin. It is recommended that the time difference between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2.
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LTE Standard Module Series 3.6.1. Turn off with PWPKEY Drive the PWRKEY pin low for at least 3 s and then release PWRKEY. After this, the module executes power-down procedure. The power-down scenario is illustrated in the following figure. VBA T 3 s 30 s PWRKEY Module Status Running Power-down procedure OFF Figure 12: Timing of Turning off Module 3.6.2.
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LTE Standard Module Series 3.7. Reset The RESET_N pin can be used to reset the module. The module can be reset by pulling the RESET_N pin low for at least 100 ms and then releasing it. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. Table 8: Pin Description of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 17 DI Reset the module VBAT power domain. If unused, keep it open.
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LTE Standard Module Series VBAT ≥ 100 ms RESET_N VIL ≤ 0.5 V Module Status Running Baseband resetting Baseband restart Figure 15: Timing of Resetting the Module ⚫ NOTE 1. 2. Ensure that there is no large capacitance exceeding 10 nF on PWRKEY and RESET_N pins. It is recommended to use RESET_N only when you fail to turn off the module with the AT+QPOWD or PWRKEY pin.
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LTE Standard Module Series 4 Application Interfaces 4.1. Analog Audio Interfaces The module provides one analog audio input channel and one analog audio output channel. The pin definitions are shown in the following table. Table 9: Pin Definition of Analog Audio Interfaces Pin Name Pin No.
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LTE Standard Module Series as possible, and the traces should be as short as possible. They should go through the filter capacitors before arriving at other connection points. To reduce radio or other signal interference, RF antennas should be placed away from audio interfaces and audio traces. Power traces should not be parallel with and also should be far away from the audio traces. The differential audio traces must be routed according to the differential signal layout rule. 4.1.2.
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LTE Standard Module Series Close to Rec eiv er Differential layout TVS 33 pF 0R 0R SPK_P Module NF SPK_N 0R 0R 10 pF 33 pF TVS 0603 Figure 17: Reference Design for Receiver Interface 4.2. USB Interface EG915U series module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes.
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LTE Standard Module Series Table 11: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS 8 AI USB connection detect Typical 5.0 V Minimum 3.5 V USB_DP 9 AIO USB differential data (+) USB_DM 10 AIO USB differential data (-) USB 2.0 compliant. Require differential impedance of 90 Ω. If unused, keep it open. For more details about the USB 2.0 specifications, visit http://www.usb.org/home.
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LTE Standard Module Series ⚫ layer and ground planes above and below. Pay attention to the selection of the ESD component on the USB data line. Its stray capacitance should not exceed 2 pF and should be placed as close as possible to the USB connector. 4.3. USB_BOOT Interface The module provides a USB_BOOT pin. You can pull up USB_BOOT to VDD_EXT before power-up and the module will enter download mode when it is turned on. In this mode, the module supports firmware upgrade over USB interface.
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LTE Standard Module Series 4.4. (U)SIM Interface The module provides 2 (U)SIM interfaces, dual SIM single stand by. The (U)SIM interfaces circuitry meets ETSI requirement. Both 1.8 V and 3.0 V (U)SIM cards are supported. Table 15: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module.
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LTE Standard Module Series VDD_EXT USIM_VDD 51K 15K 100 nF GND (U)SIM Card Connector USIM_VDD Module USIM_CLK USIM_DET VCC RST 0R USIM_RST 0R CLK GND VPP Switch IO 0R USIM_DATA GND 33 pF 33 pF 33 pF GND GND Figure 20: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_DET unconnected.
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LTE Standard Module Series ⚫ ⚫ ⚫ To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. To offer good ESD protection, it is recommended to add a TVS diode array of which the parasitic capacitance should be less than 15 pF. Add 0 Ω resistors in series between the module and the (U)SIM card to facilitate debugging. The 33 pF capacitors are used for filtering interference of EGSM900.
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LTE Standard Module Series NM 0R External 26MHz Crystal MICBIAS 0R PCM_CLK INP INN BCLK PCM_SYNC LRCK PCM_DOUT DAC PCM_DIN ADC I2C_SCL SCL I2C_SDA SDA BIAS MCLK CAM_MCLK Module 4.7K 4.7K LOUTP LOUTN Codec 1.8 V Figure 22: Reference Circuit of I2 C and PCM Application with Audio Codec NOTE 1. It is recommended to reserve an RC (R = 22 Ω, C = 22 pF) circuit on the PCM traces, especially for PCM_CLK. 2.
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LTE Standard Module Series MAIN_RTS 37 DI DTE request to send signal to DCE (connect to DTE’s RTS) MAIN_RXD 34 DI Main UART receive MAIN_DCD 38 DO Main UART data carrier detect MAIN_TXD 35 DO Main UART transmit MAIN_RI 39 DO Main UART ring indication MAIN_DTR 30 DI Main UART data terminal ready open. Table 15: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_RXD 22 DI Debug UART receive DBG_TXD 23 DO Debug UART transmit 1.
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LTE Standard Module Series Figure 23: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as follows. For the design of circuits in dotted lines, please refer to that of the circuits in solid lines, but please pay attention to the direction of connection. 4.7K VDD_EXT VDD_EXT 1 nF MCU/ARM Module 10K MAIN_RXD TXD RXD MAIN_TXD 10K VCC_MCU RTS CTS GPIO EINT GPIO GND 1 nF VDD_EXT 4.
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LTE Standard Module Series Table 17: Pin Definition of ADC Interface Pin Name Pin No. I/O ADC0 24 AI ADC1 2 AI Description Comment General-purpose ADC interface A 1 kΩ series resistor is required for use. If unused, keep it open. Table 21: Characteristics of ADC Interface Name Min. Typ. Max. Unit ADC0 Voltage Range 0.1 - VBAT V ADC1 Voltage Range 0.1 - VBAT V ADC Resolution - 12 - bits NOTE 1. 2. 3. 4.
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LTE Standard Module Series 4.8. SPI Interface The module provides one SPI interface that only supports master mode. It has a working voltage of 1.8 V and a maximum clock frequency of 25 MHz. Table 22: Pin Definition of SPI Interface Pin Name Pin No. I/O Description SPI_CLK 26 DO SPI clock SPI_CS 25 DO SPI chip select SPI_DIN 88 DI SPI master mode input SPI_DOUT 64 DO SPI master mode output Comment Just master mode only. 1.8 V power domain. If unused, keep it open.
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LTE Standard Module Series Table 18: Pin Definition of PSM Interface Pin Name Pin No. I/O Description Comment PSM_IND 1 DO Indicate the module’s power saving mode VRTC power domain PSM_EINT 96 DI External interrupt pin; Wake up the module from PSM. VRTC power domain A reference circuit is shown in the following figure. Module S1 2.2K VRTC PSM_EXT_INT Close to S1 TVS TVS Figure 25: Reference Circuit of Wake up Module from PSM 4.10.
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LTE Standard Module Series 4.10.1. Network Status Indication The network indication pins NET_STATUS can drive the network status indicators. The following tables describe pin definition and logic level changes in different network status.
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LTE Standard Module Series Table 21: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment A reference circuit is shown as below. VBAT Module 2.2K 4.7K STATUS 47K Figure 27: Reference Circuits of STATUS NOTE 4.10.3. MAIN_RI AT+QCFG= “risignaltype”, “physical” command can be used to configure MAIN_RI behavior. No matter on which port a URC is presented, the URC will trigger the behavior of MAIN_RI.
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LTE Standard Module Series Table 22: Behaviors of the MAIN_RI State Response Idle MAIN_RI keeps at high level. URC MAIN_RI outputs 120 ms low pulse when a new URC return. The MAIN_RI behavior can be changed via AT+QCFG="urc/ri/ring"*. Please refer to document [2] for details. 4.11. Control Signal Table 23: Pin Definition of Control Signal Pin Name W_DISABLE# Pin No. 18 I/O Description Comment DI Airplane mode control 1.8 V power domain. Pulled up by default.
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LTE Standard Module Series 5 Antenna Interfaces EG915U series module provides a main antenna interface, a Bluetooth/Wi-Fi Scan antenna interface. The impedance of antenna ports is 50 Ω. 5.1. Main Antenna Interface 5.1.1. Pin Definition Table 24: Pin Definition of RF Antennas Pin Name Pin No. I/O Description Comment ANT_MAIN 60 AIO Main antenna interface 50 Ω impedance.
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LTE Standard Module Series EGSM900 880-915 925-960 DCS1800 1710-1785 1805-1880 LTE-B1 1920-1980 2110-2170 LTE-B3 1710-1785 1805-1880 LTE-B5 824-849 869-894 LTE-B8 880-915 925-960 LTE-B34 2010-2025 2010-2025 LTE-B38 2570-2620 2570-2620 LTE-B39 1880-1920 1880-1920 LTE-B40 2300-2400 2300-2400 LTE-B41 2535-2675 2535-2675 Table 26: Operating Frequency of EG915U-EU Operating Frequency Transmit (MHz) Receive (MHz) GSM850 824-849 869-894 PCS1900 1850-1910 1930-1990 EGSM900
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LTE Standard Module Series Table 27: Operating Frequency of EG915U-LA Operating Frequency Transmit (MHz) Receive (MHz) GSM850 824-849 869-894 PCS1900 1850-1910 1930-1990 EGSM900 880-915 925-960 DCS1800 1710-1785 1805-1880 LTE-B2 1850-1910 1930-1990 LTE-B3 1710-1785 1805-1880 LTE-B4 1710-1755 2110-2155 LTE-B5 824-849 869-894 LTE-B7 2500-2570 2620-2690 LTE-B8 880-915 925-960 LTE-B28 703-748 758-803 LTE-B66 1710-1780 2110-2200 NOTE Only EG915U-CN supports LTE-TDD. 5.1.
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LTE Standard Module Series Main antenna Module R1 0R ANT_MAIN C1 C2 NM NM Wi-Fi Scan/ antenna R2 0R ANT_BT/ WIFI_SCAN C3 C4 NM NM Figure 28: Reference Circuit of RF Antenna 5.1.4. Operating Frequency For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50 Ω.
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LTE Standard Module Series Figure 30: Coplanar Waveguide Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: EG915U_Series_Hardware_Design 59 / 91
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LTE Standard Module Series ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
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LTE Standard Module Series Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector.
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LTE Standard Module Series Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com.
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LTE Standard Module Series 6 Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 32: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 6.0 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 1.0 A Peak Current of VBAT_RF 0 2.5 A Voltage on Digital Pins -0.3 2.
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LTE Standard Module Series Voltage drop during peak data rate - - - - mV IVBAT Peak supply current (during transmission slot) Maximum power control level at EGSM 900 - 1.7 2.5 A USB_VBUS USB connection detection - 3.5 5.0 5.25 V 6.3. Operation and Storage Temperatures Table 30: Operating and Storage Temperatures Parameter Operating Temperature Range Extended Operation Range 6 7 Storage Temperature Range Min. Typ. Max.
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LTE Standard Module Series AT+CFUN=4 (USB connected) 2.3 mA EGSM @ DRX = 2 (USB disconnected) 2.0 mA EGSM @ DRX = 5 (USB disconnected) 1.5 mA EGSM @ DRX = 5 (USB connected) 2.7 mA EGSM @ DRX = 9 (USB disconnected) 1.3 mA DCS @ DRX = 2 (USB disconnected) 2.0 mA DCS @ DRX = 5 (USB disconnected) 1.5 mA DCS @ DRX = 5 (USB connected) 2.7 mA DCS @ DRX = 9 (USB disconnected) 1.3 mA LTE-FDD @ PF = 32 (USB disconnected) 2.5 mA LTE-FDD @ PF = 64 (USB disconnected) 1.
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LTE Standard Module Series LTE-FDD B3 @ 22.86 dBm 583 mA LTE-FDD B5 @ 23.51 dBm 527 mA LTE-FDD B8 @ 22.79 dBm 568 mA LTE-FDD B34 @ 23.32 dBm 268 mA LTE-FDD B38 @ 23.29 dBm 300 mA LTE-FDD B39 @ 23.15 dBm 241 mA LTE-FDD B40 @ 22.97 dBm 284 mA LTE-FDD B41 @ 23.06 dBm 296 mA GSM900 4DL/1UL @ 32.86 dBm 226 mA GSM900 3DL/2UL @ 30.86 dBm 343 mA GSM900 2DL/3UL @ 28.81 dBm 392 mA GSM900 1DL/4UL @ 26.63 dBm 405 mA DCS1800 4DL/1UL @ 30.13 dBm 160 mA DCS1800 3DL/2UL @ 28.
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LTE Standard Module Series DCS1800P CL=7 @ 15.97 dBm 0.3 A DCS1800P CL=15 @ 0.28 dBm 0.15 A Table 32: EG915U-EU Current Consumption EG915U-EU Description Conditions Typ. Unit OFF state Power down 43 µA AT+CFUN=0 (USB disconnected) 1.01 mA AT+CFUN=0 (USB connected) 2.2 mA AT+CFUN=4 (USB disconnected) 1.02 mA AT+CFUN=4 (USB connected) 2.21 mA EGSM @ DRX = 2 (USB disconnected) 2.09 mA EGSM @ DRX = 5 (USB disconnected) 1.55 mA EGSM @ DRX = 5 (USB connected) 2.
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LTE Standard Module Series LTE data transfer GPRS data transfer EGSM @ DRX = 5 (USB connected) 27.3 mA LTE-FDD @ PF = 64 (USB disconnected) 12.38 mA LTE-FDD @ PF = 64 (USB connected) 27.58 mA LTE-FDD B1 @ 22.29 dBm 638 mA LTE-FDD B3 @ 22.88 dBm 617 mA LTE-FDD B5 @ 23.01 dBm 637 mA LTE-FDD B7 @ 22.95 dBm 793 mA LTE-FDD B8 @ 23.17 dBm 696 mA LTE-FDD B20 @ 23.05 dBm 516 mA LTE-FDD B28 @ 23.06 dBm 559 mA GSM850 4DL/1UL @ 32.96 dBm 266 mA GSM850 3DL/2UL @ 30.
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LTE Standard Module Series PCS1900 1DL/4UL @ 23.59 dBm 295 mA GSM850 PCL=5 @ 32.82 dBm 289 mA GSM850 PCL=12 @ 19.08 dBm 111 mA GSM850 PCL=19 @ 6.12 dBm 80 mA GSM900 PCL=5 @ 32.34 dBm 261 mA GSM900 PCL=12 @ 19.06 dBm 109 mA GSM900 PCL=19 @ 5.39 dBm 79 mA DCS1800P CL=0 @ 29.89 dBm 196 mA DCS1800P CL=7 @ 15.96 dBm 91 mA DCS1800P CL=15 @ 0.95 dBm 75 mA PCS1900P CL=0 @ 29.66 dBm 193 mA PCS1900P CL=7 @ 15.59 dBm 93 mA PCS1900P CL=15 @ 0.58 dBm 75 mA GSM850 PCL=5 @ 32.
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LTE Standard Module Series Table 33: EG915U-LA Current Consumption EG915U-LA Description Conditions Typ. Unit OFF state Power down 40 uA AT+CFUN=0 (USB disconnected) 0.98 mA AT+CFUN=0 (USB connected) 2.38 mA AT+CFUN=4 (USB disconnected) 1.06 mA AT+CFUN=4 (USB connected) 2.43 mA EGSM @ DRX = 2 (USB disconnected) 2.20 mA EGSM @ DRX = 5 (USB disconnected) 1.65 mA EGSM @ DRX = 5 (USB connected) 3.07 mA EGSM @ DRX = 9 (USB disconnected) 1.
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LTE Standard Module Series LTE-FDD B3 @ 22.88 dBm 667 mA LTE-FDD B4 @ 22.94d Bm 718 mA LTE-FDD B5 @ 23.01 dBm 622 mA LTE-FDD B7 @ 22.95 dBm 797 mA LTE-FDD B8 @ 23.17 dBm 644 mA LTE-FDD B28 @ 23.06 dBm 627 mA LTE-FDD B66 @ 22.81d Bm 725 mA GSM850 4DL/1UL @ 32.96 dBm 269 mA GSM850 3DL/2UL @ 30.7 dBm 394 mA GSM850 2DL/3UL @ 28.66 dBm 463 mA GSM850 1DL/4UL @ 26.41 dBm 473 mA GSM900 4DL/1UL @ 32.31 dBm 257 mA GSM900 3DL/2UL @ 30.7 dBm 372 mA GSM900 2DL/3UL @ 28.
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LTE Standard Module Series GSM900 PCL=5 @ 32.34 dBm 261 mA GSM900 PCL=12 @ 19.06 dBm 112 mA GSM900 PCL=19 @ 5.39 dBm 79 mA DCS1800P CL=0 @ 29.89 dBm 187 mA DCS1800P CL=7 @ 15.96 dBm 91 mA DCS1800P CL=15 @ 0.95 dBm 72 mA PCS1900P CL=0 @ 29.66 dBm 196 mA PCS1900P CL=7 @ 15.59 dBm 94 mA PCS1900P CL=15 @ 0.58 dBm 72 mA 6.5. Tx Power Table 34: EG915U-CN RF Output Power Frequency Bands Max. RF Output Power Min.
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LTE Standard Module Series Table 36: EG915U-LA RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850/EGSM900 33 dBm ±2 dB 5 dBm ±5 dB DCS1800/PCS1900 30 dBm ±2 dB 0 dBm ±5 dB LTE-FDD B2/B3/B4/B5/B7/B8/B28/B66 23 dBm ±2 dB < -39 dBm 6.6. Rx Sensitivity Table 37: EG915U-CN Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) 3GPP (SIMO) Frequency Primary Primary+ Diversity EGSM900 -108.0 -102 dBm DCS1800 -107.5 -102 dBm LTE-FDD B1 (10 MHz) -97.
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LTE Standard Module Series Table 38: EG915U-EU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Primary+ Diversity GSM850 -108 -102 dBm EGSM900 -106.5 -102 dBm DCS1800 -107.5 -102 dBm PCS1900 -107 -102 dBm LTE-FDD B1 (10 MHz) -97 -96.3 dBm LTE-FDD B3 (10 MHz) -98.3 -93.3 dBm LTE-FDD B5 (10 MHz) -97.4 -94.3 dBm LTE-FDD B7 (10 MHz) -96.1 -94.3 dBm LTE-FDD B8 (10 MHz) -97 -93.3 dBm LTE-FDD B20 (10 MHz) -98.3 -93.
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LTE Standard Module Series LTE-FDD B5 (10 MHz) -97.4 -94.3 dBm LTE-FDD B7 (10 MHz) -96.1 -94.3 dBm LTE-FDD B8 (10 MHz) -97.5 -93.3 dBm LTE-TDD B28 (10 MHz) -99.4 -93.3 dBm LTE-TDD B66 (10 MHz) -97.9 -95.8 dBm 6.7. ESD If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent. Thus, please take proper ESD countermeasures and handling methods.
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LTE Standard Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 7.
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LTE Standard Module Series Figure 37: Module Bottom Dimensions ⚫ NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard.
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LTE Standard Module Series 7.3 Recommended Footprint Figure 38: Recommended Footprint (TOP View) . NOTE 1. For easy maintenance of the module, keep about 3 mm between the module and other components on the motherboard. 2. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least 1.
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LTE Standard Module Series 7.3 Top and Bottom Views Figure 39: Top & Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.
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LTE Standard Module Series 8 Storage, Manufacturing & Packaging 8.1 Storage Conditions Module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60%. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
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LTE Standard Module Series NOTE 1. 2. 3. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
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LTE Standard Module Series Table 41: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1–3 °C/s Soak time (between A and B: 150 °C and 200 °C) 70–120 s Reflow Zone Max slope 2–3 °C/s Reflow time (D: over 217 °C) 40–70 s Max temperature 235–246 °C Cooling down slope -1.5 to -3 °C/s Reflow Cycle Max reflow cycle 1 NOTE 1. 2. 3. 4. 5.
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LTE Standard Module Series The figures below show the package details, measured in mm. Figure 41: Tape Specifications Table 39:Tape Size（mm） W P T A0 B0 K0 K1 F E 44 32 0.35 20.2 24 3.15 6.65 20.2 1.
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LTE Standard Module Series Figure 43: Tape and Reel Directions Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box.
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LTE Standard Module Series Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules.
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LTE Standard Module Series 9 Appendix References Table 42: Related Documents Document Name [1] Quectel_UMTS<E_EVB_User_Guide [2] Quectel_EG915U-EU_Series_AT_Commands_Manual [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_SMT_User_Guide Table 43: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR-WB Adaptive Multi-Rate Wideband AON Active Optical Network AP Application Processor bps Bits Per Second BPSK Binary Phase Shift Keying BW Bandwidth C
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LTE Standard Module Series CTS Clear To Send DAI Digital Audio Interface DCE Data Communications Equipment DC-HSDPA Dual-carrier High Speed Downlink Packet Access DDR Double Data Rate DFOTA Delta Firmware Upgrade Over The Air DL Downlink DRX Discontinuous Reception DRX Diversity Receive DTE Data Terminal Equipment DTR Data Terminal Ready EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FEM Front-End Module FR Full Rate GLONASS Global Navigati
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LTE Standard Module Series HSPA High Speed Packet Access HSUPA High Speed Uplink Packet Access IC Integrated Circuit I2C Inter-Integrated Circuit I2S Inter-IC Sound I/O Input/Output Inorm Normal Current LAA License Assisted Access LB Low Band LED Light Emitting Diode LGA Land Grid Array LMHB Low/Middle/High Band LNA Low Noise Amplifier LTE Long Term Evolution MAC Media Access Control MB Middle Band MCU Microcontroller Unit MDC Management Data Clock MDIO Management Data
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LTE Standard Module Series NSA Non-Stand Alone PA Power Amplifier PAP Password Authentication Protocol PC Personal Computer PCB Printed Circuit Board PCIe Peripheral Component Interconnect Express PCM Pulse Code Modulation PDA Personal Digital Assistant PDU Protocol Data Unit PHY Physical Layer PMIC Power Management Integrated Circuit PRX Primary Receive QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying QZSS Quasi-Zenith Satellite System RI Ring Indicator
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LTE Standard Module Series SMS Short Message Service SoC System on a Chip SPI Serial Peripheral Interface STB Set Top Box TDD Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access TRX Transmit & Receive Tx Transmit UART Universal Asynchronous Receiver/Transmitter UHB Ultra High Band UL Uplink UMTS Universal Mobile Telecommunications System URC Unsolicited Result Code USB Universal Serial Bus (U)SIM Universa
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LTE Standard Module Series VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network WWAN Wireless Wide Area Network EG915U_Series_Hardware_Design 91 / 91