Product Info

Bluetooth Module Series
HC06U_Hardware_Design 30 / 31
Table 9: Recommended Thermal Profile Parameters
7.3. Packaging Specification
The module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be
opened until the devices are ready to be soldered onto the application. The following figures show the
packaging details, measured in mm.
Factor Recommendation
Soak Zone
Max slope 1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C) 70–120 s
Reflow Zone
Max slope 2–3 °C/s
Reflow time (D: over 217 °C) 40–70 s
Max temperature 235 °C to 246 °C
Cooling down slope -1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle 1