Product Info

LTE Standard Module Series
EG95 Series Hardware Design
EG95_Series_Hardware_Design
86 / 99
EC20 R2.1 Module
Application Board
Thermal Pad
Heatsink
Shielding Cover
Thermal Pad
Heatsink
Application Board
Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
NOTE
The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides
reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip
temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover
to network connected state after the maximum temperature falls below 115°C . Therefore, the thermal
design should be maximally optimized to make sure the maximum BB chip temperature always maintains
below 105°C . Customers can execute AT+QTEMP command and get the maximum BB chip temperature
from the first returned value.