Product Info

LTE Standard Module Series
EG95 Series Hardware Design
EG95_Series_Hardware_Design
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Figure 42: Module Bottom Dimensions (Top View) .................................................................................... 84
Figure 43: Recommended Footprint (Top View) ......................................................................................... 85
Figure 44: Top View of the Module ............................................................................................................. 86
Figure 45: Bottom View of the Module ........................................................................................................ 86
Figure 46: Recommended Reflow Soldering Thermal Profile .................................................................... 88
Figure 47: Tape Specifications .................................................................................................................... 90
Figure 48: Reel Specifications .................................................................................................................... 90
Figure 49: Tape and Reel Directions .......................................................................................................... 91