Product Info

LTE Standard Module Series
EG91 Series Hardware Design
EG91_Series_Hardware_Design
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3 Application Interfaces
3.1. General Description
EG91 series module is equipped with 62-pin 1.1mm pitch SMT pads and 44-pin ground/reserved pads
that can be connected to customers’ cellular application platforms. Sub-interfaces included in these pads
are described in detail in the following chapters:
• Power supply
• (U)SIM interfaces
• USB interface
• UART interfaces
• PCM and I2C interfaces
• SPI interface
• Status indication
• USB_BOOT interface