Product Info

Wi-Fi&BT Module Series
FC21 Hardware Design
FC21_Hardware_Design 44 / 52
The recommended stencil design for FC21 is shown below. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.18mm.
Figure 23: Recommended Stencil Design
For easy maintenance of the module, please keep about 3mm between the module and other
components on host PCB.
NOTE