Product Info

5G Module Series
RM505Q-AE Hardware Design
RM505Q-AE_Hardware_Design 73 / 79
between the heatsink and the module, and the heatsink should be designed with as many fins as
possible to increase the heat dissipation area.
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
NOTE