Product Info

5G Module Series
RM500Q-AE&RM502Q-AE Hardware Design
RM500Q-AE&RM502Q-AE_Hardware_Design 74 / 83
Figure 37: Thermal Dissipation Area on Bottom Side of Module
There are other measures to enhance heat dissipation performance:
⚫ Add ground vias as many as possible on PCB.
⚫ Maximize airflow over/around the module.
⚫ Place the module away from other heating sources.
⚫ Module mounting holes must be used to attach (ground) the device to the main PCB ground.
⚫ It is NOT recommended to apply solder mask on the main PCB where the module’s thermal
dissipation area is located.
⚫ Select an appropriate material, thickness and surface for the outer housing (i.e. the mechanical
enclosure) of the application device that integrates the module so that it provides good thermal
dissipation.
⚫ Customers may also need active cooling to pull heat away from the module.
⚫ If possible, add a heatsink on the top of the module. A thermal pad should be used between the
heatsink and the module, and the heatsink should be designed with as many fins as possible to
increase heat dissipation area.
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
NOTE