Product Info

5G Module Series
RM500Q-AE&RM502Q-AE Hardware Design
RM500Q-AE&RM502Q-AE_Hardware_Design 14 / 83
LTE: Max 1.0 Gbps(DL)/ 200 Mbps (UL)
RM502Q-AE
LTE: 2.0 Gbps (DL) /200 Mbps (UL)
UMTS Features
Support 3GPP R8 DC-HSDPA, HSPA +, HSDPA, HSUPA and WCDMA
Support QPSK, 16QAM and 64QAM modulation
Max. transmission data rates
2)
:
DC-HSDPA: Max 42 Mbps (DL)
HSUPA: Max 5.76 Mbps (UL)
WCDMA: Max 384 kbps (DL)/384 kbps (UL)
Internet Protocol
Features
Support QMI/NTP* protocols
Support the protocols PAP and EIRP usually used for PPP connections
SMS
Text and PDU modes
Point-to-point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface
Support (U)SIM card: Class B (3.0 V) and Class C(1.8 V)
(U)SIM interface
Support Single (U)SIM
USB Interface
Compliant with USB 3.1 and 2.0 specifications, with maximum transmission
rates up to 10 Gbps on USB 3.1 and 480 Mbps on USB 2.0.
Used for AT command communication, data transmission, firmware
upgrade, software debugging, GNSS NMEA sentence output.
Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.65.4, Android
4.x/5.x/6.x/7.x/8.x/9.x/10
PCIe × 1 Interface
Complaint with PCIe GEN3, support 8 Gbps per lane, PCIe × 1.
Used for AT command communication, data transmission, firmware
upgrade, software debugging, GNSS NMEA sentence output
Rx-diversity
Support 5G NR/LTE/WCDMA Rx-diversity
GNSS Features
Gen9 Lite of Qualcomm
Protocol: NMEA 0183
Data Update Rate: 1 Hz
AT Commands
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Antenna Interfaces
ANT0, ANT1, ANT2, and ANT3_GNSSL1
Physical
Characteristics
Size: (52.0 ±0.15) mm × (30.0 ±0.15) mm × (2.3 ±0.2) mm
Weight: approx. 8.7
Temperature Range
Operating temperature range: -20 to +60 °C
4)
Restricted Operating temperature range: -30 to -20 °C, +60 to +75 °C
Extended temperature range: -40 to -30 °C, +75 to +85 °C
5)
Storage temperature range: -40 to +90°C
Firmware Upgrade
USB 2.0 interface, PCIe interface and DFOTA