Product Info

LTE Standard Module Series
EC25 Mini PCIe Hardware Design
EC25_Mini_PCIe_Hardware_Design 75 / 80
Table 51: GNSS Current Consumption of EC25 Mini PCIe Series Module
6.7. Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
⚫ On customers’ PCB design, please keep placement of the PCI Express Mini Card away from heating
sources.
⚫ Do not place components on the PCB area where the module is mounted, in order to facilitate adding
of heatsink.
⚫ Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heat
dissipation performance.
⚫ The reference ground of the area where the module is mounted should be complete, and add ground
LTE-FDD B20 @22.71dBm
909.1
mA
LTE-FDD B28A @21.79dBm
898.1
mA
LTE-TDD B38 @22.85dBm
587.8
mA
LTE-TDD B40 @22.96dBm
460.6
mA
LTE-TDD B41 @22.69dBm
571.2
mA
GSM
voice call
EGSM900 PCL=5 @32.80dBm
370.0
mA
DCS1800 PCL=0 @29.51dBm
221.0
mA
WCDMA voice
call
WCDMA B1 @22.96dBm
829.5
mA
WCDMA B8 @23.21dBm
752.9
mA
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
(GNSS)
Searching
(AT+CFUN=0)
Cold start @Passive Antenna
75.0
mA
Lost state @Passive Antenna
74.0
mA
Tracking
(AT+CFUN=0)
Instrument environment
44.0
mA
Open Sky @Passive Antenna
53.0
mA
Open Sky @Active Antenna
58.0
mA