Product Info

LTE Standard Module Series
EC25 Series Hardware Design
EC25_Series_Hardware_Design 3 / 126
module into Table 41.
5. Added EC25-AF conducted RF receiving sensitivity
in Table 50.
2.0
2019-04-30
Nathan LIU/
Frank WANG/
Ward WANG/
Ethan SHAN
1. Added new variants EC25-EU/-EC/-EUX/-MX and
related information.
2. Updated functional diagram in Figure 1.
3. Updated star structure of the power supply in Figure
8.
4. Updated power-on scenario of module in Figure 12.
5. Updated reference circuit with translator chip in
Figure 20.
6. Added timing sequence for entering into emergency
download mode of USB_BOOT interface in Figure 32.
7. Updated general description in Table 1.
8. Updated module operating frequencies in Table 27.
9. Updated GNSS frequency in Table 29.
10. Updated antenna requirements in Table 30.
11. Updated EC25-V current consumption in Table 36.
12. Added EC25-EU current consumption in Table 41
13. Added EC25 EC current consumption in Table 42.
14. Added EC25-EUX current consumption in Table 43.
15. Added EC25-MX current consumption in Table 44.
16. Updated EC25-E conducted RF receiving sensitivity
in Table 47.
17. Updated EC25-A conducted RF receiving sensitivity
in Table 48.
18. Updated EC25-V conducted RF receiving sensitivity
in Table 49.
19. Updated EC25-AUT conducted RF receiving
sensitivity in Table 52.
20. Updated EC25-AUTL conducted RF receiving
sensitivity in Table 53.
21. Added EC25-EU conducted RF receiving sensitivity in
Table 55.
22. Added EC25 EC conducted RF receiving sensitivity in
Table 56
Added EC25-EUX conducted RF receiving sensitivity in
Table 57.
23. Added EC25-MX conducted RF receiving sensitivity
in Table 58.
24. Updated recommended stencil thickness as
0.18–0.20 mm and reflow soldering thermal profile in
Chapter 8.2.