Product Info
LTE Standard Module Series
EC25 Series Hardware Design
EC25_Series_Hardware_Design 12 / 126
Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) .............................. 115
Figure 44: Module Top and Side Dimensions ................................................................................................. 116
Figure 45: Module Bottom Dimensions (Bottom View) .................................................................................... 117
Figure 46: Recommended Footprint (Top View) ............................................................................................. 118
Figure 47: Top View of the Module .................................................................................................................. 119
Figure 48: Bottom View of the Module ............................................................................................................ 119
Figure 49: Reflow Soldering Thermal Profile ................................................................................................... 121
Figure 50: Tape Specifications ........................................................................................................................ 122
Figure 51: Reel Specifications ......................................................................................................................... 123
Figure 52: Tape and Reel Directions ............................................................................................................... 123