Product Info
LPWA Module Series
BG95 Series Hardware Design
BG95_Series_Hardware_Design 92 / 106
1.10
1.95
0.551.10
5.10
1.00
8.50
0.85
1.70
1.00
1.00
1.70
1.70
0.55
1.90
1.10
0.50
0.70
0.25
0.25
0.25
23.60±0.15
40x1.0
40x1.0
62x0.7
62x1.10
1.00
1.00
1.10
0.25
19.90±0.15
Figure 35: Module Bottom Dimensions (Bottom View)
The package warpage level of the module conforms to JEITA ED-7306 standard.
Pin 1
NOTE