LPWA Module Series
BG600L-M3 Hardware Design
BG600L-M3_Hardware_Design 80 / 83
Table 44: Module Packaging Specifications
MOQ for MP Minimum Package: 250 Minimum Package x 4 = 1000
250
Size: 370 mm × 350 mm × 56 mm
N.W: TBD
G.W: TBD
Size: 380 mm × 250 mm × 365 mm
N.W: TBD
G.W: TBD
