Product Info

Smart Module Series
SC600Y&SC600T Hardware Design
SC600Y&SC600T_Hardware_Design 105 / 134
Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
In order to ensure RF performance and reliability, the following principles should be complied
with in RF layout design:
 Use an impedance simulation tool to accurately control the characteristic impedance of RF
traces to 50Ω.
 The GND pins adjacent to RF pins should not be designed as thermal relief pins, and should
be fully connected to ground.
 The distance between the RF pins and the RF connector should be as short as possible, and