Product Info

LTE Standard Module Series
EG95 Hardware Design
EG95_Hardware_Design 19 / 93
3 Application Interfaces
3.1. General Description
EG95 is equipped with 62-pin 1.1mm pitch SMT pads and 44-pin ground/reserved pads that can be
connected to customers cellular application platforms. Sub-interfaces included in these pads are
described in detail in the following chapters:
Power supply
(U)SIM interfaces
USB interface
UART interfaces
PCM and I2C interfaces
SPI interface
1)
Status indication
USB_BOOT interface
1)
SPI interface is not supported on ThreadX modules.
NOTE