Product Info

LTE Standard Module Series
EG95 Hardware Design
EG95_Hardware_Design 10 / 93
FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 77
FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
............................................................................................................................................................... 77
FIGURE 41: MODULE TOP AND SIDE DIMENSIONS................................................................................... 78
FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW)........................................................................ 79
FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 80
FIGURE 44: TOP VIEW OF THE MODULE ................................................................................................... 81
FIGURE 45: BOTTOM VIEW OF THE MODULE ........................................................................................... 81
FIGURE 46: REFLOW SOLDERING THERMAL PROFILE ............................................................................ 83
FIGURE 47: TAPE DIMENSIONS .................................................................................................................. 84
FIGURE 48: REEL DIMENSIONS .................................................................................................................. 85
FIGURE 49: TAPE AND REEL DIRECTIONS ................................................................................................ 85