Product Info

LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 10 / 96
FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 80
FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
............................................................................................................................................................... 80
FIGURE 41: MODULE TOP AND SIDE DIMENSIONS................................................................................... 81
FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW)........................................................................ 82
FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 83
FIGURE 44: TOP VIEW OF THE MODULE ................................................................................................... 84
FIGURE 45: BOTTOM VIEW OF THE MODULE ........................................................................................... 84
FIGURE 46: REFLOW SOLDERING THERMAL PROFILE ............................................................................ 86
FIGURE 47: TAPE DIMENSIONS .................................................................................................................. 87
FIGURE 48: REEL DIMENSIONS .................................................................................................................. 88
FIGURE 49: TAPE AND REEL DIRECTIONS ................................................................................................ 88