Product Info

LTE-A Module Series
EG12 Hardware Design
EG12_Hardware_Design 88 / 100
1. Make sure that customers’ PCB design provides sufficient cooling solutions for the module: proper
mounting, heatsinks, and active cooling may be required depending on the integrated application.
2. In order to protect the components from damage, the thermal design should be maximally optimized
to guarantee that the module’s internal temperature always maintains below 105°C . Customers can
execute AT+QTEMP command to get the module’s internal temperature.
3. For more detailed guidelines on thermal design, please refer to document [7].
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