Product Info

LTE-A Module Series
EG12 Hardware Design
EG12_Hardware_Design 5 / 100
6.8. Thermal Consideration ............................................................................................................ 86
7 Mechanical Dimensions .................................................................................................................... 89
7.1. Mechanical Dimensions of the Module.................................................................................... 89
7.2. Recommended Footprint ......................................................................................................... 91
7.3. Design Effect Drawings of the Module .................................................................................... 92
8 Storage, Manufacturing and Packaging .......................................................................................... 93
8.1. Storage .................................................................................................................................... 93
8.2. Manufacturing and Soldering .................................................................................................. 94
8.3. Packaging ................................................................................................................................ 95
9 Appendix A References ..................................................................................................................... 97