Product Info

LTE-A Module Series
EG12 Hardware Design
EG12_Hardware_Design 9 / 100
................................................................................................................................................................... 74
FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 76
FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 76
FIGURE 41: SPACE FACTOR OF MATING PLUGS (UNIT: MM) .................................................................... 77
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ................. 87
FIGURE 43: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................... 87
FIGURE 44: MODULE TOP AND SIDE DIMENSIONS .................................................................................... 89
FIGURE 45: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 90
FIGURE 46: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 91
FIGURE 47: TOP VIEW OF THE MODULE ...................................................................................................... 92
FIGURE 48: BOTTOM VIEW OF THE MODULE .............................................................................................. 92
FIGURE 49: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 94
FIGURE 50: TAPE SPECIFICATIONS.............................................................................................................. 95
FIGURE 51: REEL SPECIFICATIONS.............................................................................................................. 96