Product Info

LTE Module Series
EC25 Hardware Design
EC25_Hardware_Design 11 / 112
FIGURE 38: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 79
FIGURE 39: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 79
FIGURE 40: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 80
FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ............... 100
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................. 100
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS .................................................................................. 102
FIGURE 44: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ............................................................... 103
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 104
FIGURE 46: TOP VIEW OF THE MODULE .................................................................................................... 105
FIGURE 47: BOTTOM VIEW OF THE MODULE ............................................................................................ 105
FIGURE 48: REFLOW SOLDERING THERMAL PROFILE ............................................................................ 107
FIGURE 49: TAPE AND REEL SPECIFICATIONS ........................................................................................ 108