Product Info

LTE Module Series
EC25 Hardware Design
EC25_Hardware_Design 107 / 112
8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted
properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality,
thethickness of stencil for the module is recommended to be 0.20mm. For more details, please refer to
document [4].
It is suggested that the peak reflow temperature is 235ºC~245ºC (for SnAg3.0Cu0.5 alloy). The absolute
maximum reflow temperature is 260ºC. To avoid damage to the module caused by repeated heating, it is
suggested that the module should be mounted after reflow soldering for the other side of PCB has been
completed. Recommended reflow soldering thermal profile is shown below:
Figure 48: Reflow Soldering Thermal Profile