Product Info

LTE Module Series
EC25 Hardware Design
EC25_Hardware_Design 100 / 112
 According to customers’ application demands, the heatsink can be mounted on the top of the module,
or the opposite side of the PCB area where the module is mounted, or both of them.
 The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows two kinds of heatsink designs for reference and customers can choose one or both
of them according to their application structure.
Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module)
Figure 42: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)