Product Info

LTE Standard Module Series
EC21 Mini PCIe Hardware Design
EC21_Mini_PCIe_Hardware_Design 60 / 64
Table 39: GNSS Current Consumption of EC21 Mini PCIe Series Module
6.7. Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
 On customers’ PCB design, please keep placement of the PCI Express Mini Card away from heating
sources.
 Do not place components on the PCB area where the module is mounted, in order to facilitate adding
of heatsink.
LTE-FDD B8 @23.04dBm 807.4 mA
LTE-FDD B28A @23.54dBm 932.0 mA
LTE-TDD B40 @23.79dBm 585.2 mA
GSM
voice call
GSM850 PCL=5 @32.80dBm 316.2 mA
EGSM900 PCL=5 @33.16dBm 348.7 mA
DCS1800 PCL=0 @29.81dBm 216.8 mA
PCS1900 PCL=0 @29.79dBm 214.9 mA
WCDMA voice
call
WCDMA B1 @23.27dBm 823.4 mA
WCDMA B2 @22.89dBm 898.7 mA
WCDMA B5 @22.87dBm 776.9 mA
WCDMA B8 @22.89dBm 685.6 mA
Parameter Description Conditions Typ. Unit
I
VBAT
(GNSS)
Searching
(AT+CFUN=0)
Cold start @Passive Antenna 75.0 mA
Lost state @Passive Antenna 74.0 mA
Tracking
(AT+CFUN=0)
Instrument environment 44.0 mA
Open Sky @Passive Antenna 53.0 mA
Open Sky @Active Antenna 58.0 mA