Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- 1 Introduction
- 2 Product Concept
- 3 Application Interfaces
- 3.1. General Description
- 3.2. Pin Assignment
- 3.3. Pin Description
- 3.4. Power Supply
- 3.5. Turn on and off Scenarios
- 3.6. VRTC Interface
- 3.7. Power Output
- 3.8. Battery Charge and Management
- 3.9. USB Interfaces
- 3.10. UART Interfaces
- 3.11. (U)SIM Interfaces
- 3.12. SD Card Interface
- 3.13. GPIO Interfaces
- 3.14. I2C Interfaces
- 3.15. I2S Interfaces
- 3.16. SPI Interface
- 3.17. ADC Interfaces
- 3.18. LCM Interfaces
- 3.19. Touch Panel Interfaces
- 3.20. Camera Interfaces
- 3.21. Sensor Interfaces
- 3.22. Audio Interfaces
- 3.23. Emergency Download Interface
- 4 Wi-Fi and BT
- 5 GNSS
- 6 Antenna Interfaces
- 7 Electrical, Reliability and Radio Characteristics
- 8 Mechanical Dimensions
- 9 Storage, Manufacturing and Packaging
- 10 Appendix A References
- 11 Appendix B GPRS Coding Schemes
- 12 Appendix C GPRS Multi-slot Classes
- 13 Appendix D EDGE Modulation and Coding Schemes
- IC & FCC Requirement
Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 134 / 139
9.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.18mm~0.20mm. It is recommended to slightly
reduce the amount of solder paste for LGA pads, thus avoiding short-circuit. For more details, please refer
to document [4].
It is suggested that the peak reflow temperature is 238~245ºC, and the absolute maximum reflow
temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (°C)
Reflow Zone
Soak Zone
245
200
220
238
C
D
B
A
150
100
Max slope: 1~3°C/sec
Cooling down
slope: 1~4°C/sec
Max slope:
2~3°C/sec
Figure 53: Recommended Reflow Soldering Thermal Profile
Table 62: Recommended Thermal Profile Parameters
Factor Recommendation
Soak Zone
Max slope 1 to 3°C/sec
Soak time (between A and B: 150°C and 200°C) 60 to 120 sec