Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- 1 Introduction
- 2 Product Concept
- 3 Application Interfaces
- 3.1. General Description
- 3.2. Pin Assignment
- 3.3. Pin Description
- 3.4. Power Supply
- 3.5. Turn on and off Scenarios
- 3.6. VRTC Interface
- 3.7. Power Output
- 3.8. Battery Charge and Management
- 3.9. USB Interfaces
- 3.10. UART Interfaces
- 3.11. (U)SIM Interfaces
- 3.12. SD Card Interface
- 3.13. GPIO Interfaces
- 3.14. I2C Interfaces
- 3.15. I2S Interfaces
- 3.16. SPI Interface
- 3.17. ADC Interfaces
- 3.18. LCM Interfaces
- 3.19. Touch Panel Interfaces
- 3.20. Camera Interfaces
- 3.21. Sensor Interfaces
- 3.22. Audio Interfaces
- 3.23. Emergency Download Interface
- 4 Wi-Fi and BT
- 5 GNSS
- 6 Antenna Interfaces
- 7 Electrical, Reliability and Radio Characteristics
- 8 Mechanical Dimensions
- 9 Storage, Manufacturing and Packaging
- 10 Appendix A References
- 11 Appendix B GPRS Coding Schemes
- 12 Appendix C GPRS Multi-slot Classes
- 13 Appendix D EDGE Modulation and Coding Schemes
- IC & FCC Requirement
Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 133 / 139
9 Storage, Manufacturing and
Packaging
9.1. Storage
SC66 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are shown below.
1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.
Stored at <10%RH.
3. Devices require baking before mounting, if any circumstance below occurs.
When the ambient temperature is 23ºC±5ºC and the humidity indication card shows the humidity
is >10% before opening the vacuum-sealed bag.
Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%.
4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.
As the plastic package cannot be subjected to hig
h temperature, it should be removed from devices
before high temperature (120ºC) b
aking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
NOTE