Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- 1 Introduction
- 2 Product Concept
- 3 Application Interfaces
- 3.1. General Description
- 3.2. Pin Assignment
- 3.3. Pin Description
- 3.4. Operating Modes
- 3.5. Power Saving
- 3.6. Power Supply
- 3.7. Power-on/off Scenarios
- 3.8. Reset the Module
- 3.9. (U)SIM Interfaces
- 3.10. USB Interface
- 3.11. UART Interfaces
- 3.12. PCM and I2C Interfaces
- 3.13. SPI Interface
- 3.14. Network Status Indication
- 3.15. STATUS
- 3.16. ADC Interface
- 3.17. Behaviors of RI
- 3.18. USB_BOOT Interface
- 4 GNSS Receiver
- 5 Antenna Interfaces
- 6 Electrical, Reliability and Radio Characteristics
- 7 Mechanical Dimensions
- 8 Storage, Manufacturing and Packaging
- 9 Appendix A References
- 10 Appendix B GPRS Coding Schemes
- 11 Appendix C GPRS Multi-slot Classes
- 12 Appendix D EDGE Modulation and Coding Schemes
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 83 / 93
8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil
openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to
produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of
stencil for the module is recommended to be 0.15mm~0.18mm. For more details, please refer to
document [4].
It is suggested that the peak reflow temperature is 238ºC~245ºC, and the absolute maximum reflow
temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (°C)
Reflow Zone
Soak Zone
245
200
220
238
C
D
B
A
150
100
Max slope: 1~3°C/sec
Cooling down
slope: 1~4°C/sec
Max slope:
2~3°C/sec
Figure 46: Reflow Soldering Thermal Profile
Table 45: Recommended Thermal Profile Parameters
Factor Recommendation
Soak Zone
Max slope 1 to 3°C/sec
Soak time (between A and B: 150°C and 200°C) 60 to 120 sec
Reflow Zone