Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- 1 Introduction
- 2 Product Concept
- 3 Application Interfaces
- 3.1. General Description
- 3.2. Pin Assignment
- 3.3. Pin Description
- 3.4. Operating Modes
- 3.5. Power Saving
- 3.6. Power Supply
- 3.7. Power-on/off Scenarios
- 3.8. Reset the Module
- 3.9. (U)SIM Interfaces
- 3.10. USB Interface
- 3.11. UART Interfaces
- 3.12. PCM and I2C Interfaces
- 3.13. SPI Interface
- 3.14. Network Status Indication
- 3.15. STATUS
- 3.16. ADC Interface
- 3.17. Behaviors of RI
- 3.18. USB_BOOT Interface
- 4 GNSS Receiver
- 5 Antenna Interfaces
- 6 Electrical, Reliability and Radio Characteristics
- 7 Mechanical Dimensions
- 8 Storage, Manufacturing and Packaging
- 9 Appendix A References
- 10 Appendix B GPRS Coding Schemes
- 11 Appendix C GPRS Multi-slot Classes
- 12 Appendix D EDGE Modulation and Coding Schemes
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 77 / 93
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG
91
Module
Shielding Cover
Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
1. The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it
will recover to network connected state after the maximum temperature falls below 115°C.
Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip
temperature always maintains below 105°C. Customers can execute AT+QTEMP command and
get the maximum BB chip temperature from the first returned value.
2. For more detailed guidelines on thermal design, please refer to
document [6]
.
NOTES