Product Info

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 25 / 112
6. Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on the BT
module.
7. Keep all RESERVED pins and unused pins unconnected.
8. GND pads 85~112 should be connected to ground in the design. RESERVED pads 73~84 should not
be designed in schematic and PCB decal, and these pins should be served as a keepout area.
9. “*” means under development.
3.3. Pin Description
The following tables show the pin definition of EC25 module.
Table 3: I/O Parameters Definition
Table 4: Pin Description
Type Description
AI Analog input
AO Analog output
DI Digital input
DO Digital output
IO Bidirectional
OD Open drain
PI Power input
PO Power output
Power Supply
Pin Name Pin No. I/O Description DC Characteristics Comment
VBAT_BB 59, 60 PI
Power supply for
module’s baseband
part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 0.8A.
VBAT_RF 57, 58 PI
Power supply for
module’s RF part
Vmax=4.3V
Vmin=3.3V
It must be able to
provide sufficient