Product Info

Automotive Module Series
AG35 Hardware Design
AG35_Hardware_Design 120 / 129
7.2. Recommended Footprint
33.00±0.15
3.50
3.45
0.70
1.65
3.15
3.15
3.45
1.30
2.75
37.50±0.15
R0.70
3.45
3.15
0.50
1.30
0.30
0.35
1.00
0.70
1.30
1.30
1.40
0.70
2.50
3.30
1.00
4.1
3.80
4.45
3.80
Figure 46: Module Bottom Dimensions (Top View)
For convenient maintenance of the module, please keep about 3mm between the module and other
components on the host PCB.
NOTE
Pin 1