Product Info

LTE Module Series
EG21-G MINIPCIE Hardware Design
EG21-G_MINIPCIE_Hardware_Design 37 / 48
Thermal Pad
Application Board
Application Board
Heatsink
Thermal Pad
EG21-G Module
EG21-G Mini PCIe
Heatsink
PCI Express Mini Card Connector
Shielding Cover
Thermal Pad
Figure 17: Referenced Heatsink Design
1. The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115°C. Therefore, the
thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105°C. Customers can execute AT+QTEMP command and get the
maximum BB chip temperature from the first returned value.
2. For more detailed guidelines on thermal design, please refer to document [4].
4.8. Current Consumption
Table 21: Current Consumption of EG21-G MINIPCIE
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
Sleep state
AT+CFUN=0 (USB disconnected)
TBD
mA
EGSM @DRX=2 (USB disconnected)
TBD
mA
EGSM @DRX=5 (USB disconnected)
TBD
mA
EGSM @DRX=5 (USB suspended)
TBD
mA
NOTES