Product Info

LTE Module Series
EG21-G MINIPCIE Hardware Design
EG21-G_MINIPCIE_Hardware_Design 36 / 48
4.6. ESD Characteristics
The following table shows the ESD characteristics of EG21-G MINIPCIE.
Table 20: ESD Characteristics of EG21-G MINIPCIE
4.7. Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
 On customers’ PCB design, please keep placement of the PCI Express Mini Card away from heating
sources.
 Do not place components on the PCB area where the module is mounted, in order to facilitate adding
of heatsink.
 Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heat
dissipation performance.
 The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.
 Add a heatsink on the top of the module and the heatsink should be designed with as many fins as
possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity
should be used between the heatsink and module.
 Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to
PCB.
The following figure shows the referenced heatsink design.
Part
Contact Discharge
Air Discharge
Unit
Power Supply and GND
+/-5
+/-10
kV
Antenna Interfaces
+/-4
+/-8
kV
USB Interface
+/-4
+/-8
kV
(U)SIM Interface
+/-4
+/-8
kV
Others
+/-0.5
+/-1
kV